2 features, Features – AMD Geode LX [email protected] User Manual

Page 12

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12

AMD Geode™ LX Processors Data Book

Overview

33234H

1.2

Features

General Features

Functional blocks include:
— CPU Core
— GeodeLink™ Control Processor
— GeodeLink Interface Units
— GeodeLink Memory Controller
— Graphics Processor
— Display Controller
— Video Processor

– TFT Controller/Video Output Port

— Video Input Port
— GeodeLink PCI Bridge
— Security Block

0.13 micron process

Packaging:
— 481-Terminal BGU (Ball Grid Array Cavity Up) with

internal heatspreader

Single packaging option supports all features

Industrial temperature range available for the
LX [email protected] processor*

CPU Processor Features

x86/x87-compatible CPU core

Performance:
— Processor frequency: up to 600 MHz
— Dhrystone 2.1 MIPs: 150 to 450
— Fully pipelined FPU

Split I/D cache/TLB (Translation Look-aside Buffer):
— 64 KB I-cache/64 KB D-cache
— 128 KB L2 cache configurable as I-cache, D-cache,

or both

Efficient prefetch and branch prediction

Integrated FPU that supports the MMX™ and
AMD 3DNow!™ instruction sets

Fully pipelined single precision FPU hardware with
microcode support for higher precisions

GeodeLink™ Control Processor

JTAG interface:
— ATPG, Full Scan, BIST on all arrays
— 1149.1 Boundary Scan compliant

ICE (in-circuit emulator) interface

Reset and clock control

Designed for improved software debug methods and
performance analysis

Power Management:
— LX [email protected] processor* (Unterminated):

Total Dissipated Power (TDP) 5.1W,
2.6W typical @ 600 MHz max power

— LX [email protected] processor* (Unterminated):

Total Dissipated Power (TDP) 3.6W,
1.8W typical @ 500 MHz max power

— LX [email protected] processor* (Unterminated):

Total Dissipated Power (TDP) 3.1W,
1.3W typical @ 433 MHz max power

— LX [email protected] processor* (Unterminated):

Total Dissipated Power (TDP) 2.8W,
1.2W typical @ 366 MHz max power

— GeodeLink active hardware power management
— Hardware support for standard ACPI software power

management

— I/O companion SUSP/SUSPA power controls
— Lower power I/O
— Wakeup on SMI/INTR

Works in conjunction with the AMD Geode™ CS5536
(USB 2.0) or CS5535 (USB 1.1) companion device

GeodeLink™ Architecture

High bandwidth packetized uni-directional bus for
internal peripherals

Standardized protocol to allow variants of products to be
developed by adding or removing modules

GeodeLink Control Processor (GLCP) for diagnostics
and scan control

Dual GeodeLink Interface Units (GLIUs) for device inter-
connect

GeodeLink™ Memory Controller

Integrated memory controller for low latency to CPU and
on-chip peripherals

64-bit wide DDR SDRAM bus operating frequency:
— 200 MHz, 400 MT/S

Supports unbuffered DDR DIMMS using up to 2 GB
DRAM technology

Supports up to 2 DIMMS (16 devices max)

2D Graphics Processor

High performance 2D graphics controller

Alpha BLT

Windows

®

GDI

GUI acceleration:

— Hardware support for all Microsoft RDP codes

Command buffer interface for asynchronous BLTs

Second pattern channel support

Hardware screen rotation

*The AMD Geode LX [email protected] processor operates at 600 MHz, the AMD Geode LX [email protected] processor operates at 500 MHz, the
AMD Geode LX [email protected] processor operates at 433 MHz and the AMD Geode LX [email protected] processor operates at 366 MHz. Model
numbers reflect performance as described here:

http://www.amd.com/connectivitysolutions/geodelxbenchmark

.

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