kurtz ersa HR 600 EN - Manual

Ersa Hybrid Rework System HR 600
Ersa High-End-Rework: The
combination of a proven techno-
logy with innovative image pro-
cessing sets new standards!
The task formulated for the ERSA HR 600 Hyb-
rid Rework System was to offer professional,
automated rework of sub-assemblies for the
electronic industry. With the system now at
hand, almost all high pin-out components that
may be found on modern board assemblies,
and of virtually any shape, can be reliably
reworked. The core competencies of this uni-
versal rework system are the placement of
components, their lifting off and their cont-
rolled setting down, as well as the soldering
process.
Special attention was placed on the automa-
tion of the individual process steps. All opera-
tions can be controlled in a step-by-step mode
by the operator himself, or they can be com-
bined to automated operation, requiring very
few interventions by the operator.
To preheat the complete board area of the as-
sembly mounted in the board holder, the sys-
tem utilizes highly dynamic IR-heating ele-
ments in the lower heater cassette. A hybrid
heating head combines the heat transfer me-
thod of IR radiation with that of convection
heating for a targeted, and therefore highly ef-
ficient, warming of the components to be
worked on. Applying this method, quick and
top-quality de-soldering and soldering result
Automatic de-soldering Laser marking of the targeted position Automatic component placement
Rework of Board Assemblies newly defined - Flexible, efficient, automated, reliable!
Technical Highlights
Automated component placement
Automated de-soldering and soldering pro-
cess
Hybrid heater head with two heating
zones for effective heat transfer
Extensive, powerful IR-bottom side
heating cassette with 3 zones
Non-contact temperature measurement with
digital sensor
Two K-type thermocouple inputs
Accu-TC sensor
Effective assembly cooling with
compressed air
are being achieved. An optional Reflow-Pro-
cess-Camera (RPC) with LED illumination is
available for process monitoring and documen-
tation.
Placement of the components is a largely au-
tomatic process; the integrated image proces-
sing software assesses data of images genera-
ted by the two cameras installed. The required
component position is automatically calculated,
and the component is placed, independent of
an operator, using a vacuum pipette mounted
on an axis-system.
The system is prepared for the mounting of the
ERSA Dip & Print frame. Printing the solder
paste onto the component takes place exter-
nally on the Dip & Print Station; dipping the
component into the flux depot is equally a fully
automated process.