AMD Turion 64 User Manual

Advanced micro devices, Pin package specific features

Advertising
background image

Advanced Micro Devices

AMD Turion™ 64 Mobile Technology
Product Data Sheet

Compatible with Existing 32-Bit Code Base

Including support for SSE, SSE2, SSE3*, MMX™,
3DNow!™ technology, and legacy x86 instructions
*SSE3 supported by Rev. E and later processors

Runs existing operating systems and drivers

Local APIC on the chip

AMD64 Technology

AMD64 technology instruction set extensions

64-bit integer registers, 48-bit virtual addresses,
40-bit physical addresses

Eight additional 64-bit integer registers (16 total)

Eight additional 128-bit SSE registers (16 total)

Enhanced Virus Protection

No Execute (NX) bit in page-translation tables
specifies whether code can be executed from the
page

HyperTransport™ Technology to I/O Devices

One 16-bit link supporting speeds up to 800 MHz
(1600 MT/s) or 3.2 Gbytes/s in each direction

64-Kbyte 2-Way Associative ECC-Protected
L1 Data Cache

Two 64-bit operations per cycle, 3-cycle latency

64-Kbyte 2-Way Associative Parity-Protected
L1 Instruction Cache

With advanced branch prediction

16-Way Associative ECC-Protected
L2 Cache

Exclusive cache architecture—storage in addition
to L1 caches

Up to 1 Mbyte per L2 cache

1 Mbyte and 512-Kbyte options

Machine Check Architecture

Includes hardware scrubbing of major
ECC-protected arrays

754-Pin Package Specific Features

Refer to the AMD Functional Data Sheet,
754-Pin Package
, order# 31410, for functional,
mechanical, and electrical details of 754-pin
packages.

Packaging

754-pin lidless micro PGA

1.27-mm pin pitch

29 x 29-row pin array

40 mm x 40 mm organic substrate

Organic C4 die attach

Integrated Memory Controller

Low-latency, high-bandwidth

72-bit DDR SDRAM at 100, 133, 166, and 200 MHz

Supports up to two unbuffered SO-DIMMs

ECC checking with double-bit detect and single-bit
correct

Electrical Interfaces

HyperTransport™ technology: LVDS-like
differential, unidirectional

DDR SDRAM: SSTL_2 per JEDEC specification

Clock, reset, and test signals also use DDR
SDRAM-like electrical specifications.

Power Management

Multiple low-power states including Deeper Sleep
(C3 with AltVID)

System Management Mode (SMM)

ACPI compliant, including support for processor
performance states

AMD PowerNow!™ technology is designed to
dynamically switch between multiple low-power
states based on application performance
requirements.

32816

Publication #

3.05

Revision:

September 2006

Issue Date:

Advertising
Table of contents