HMC Electronics R500 Kester Solder Paste User Manual

R500, Product description, Standard applications

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R500

R500

Dispensable Water-soluble Solder Paste

Dispensable Water-soluble Solder Paste

for Leaded Alloys

for Leaded Alloys

Product Description

Kester R500 is a water-soluble solder paste
formula specifically designed as a consistent dot
dispensing paste for automated dispense equipment.
This solder paste exhibits excellent wetting
characteristics in a wide range of profiles. The
activator package in this formula is extremely
aggressive. It is active enough to remove tenacious
oxide layers or to solder to OSP coated boards.
Kester R500 is a water soluble formula that
maintains its activity and tackiness characteristics
for up to 8 hours.

• Excellent dispensing characteristics using 21

gauge needles and Type 3 powder

• Capable of dispensing rate of 4 dots per

second

• Leaves bright/shiny solder joints after reflow
• Packaged Void-Free
• Scrap is reduced due to minimal paste clog-

ging and separation

• Residues easily removed with DI water
• Classified as ORM0 per J-STD-004

Standard Applications

86% Metal -- Syringe Dispensing

Physical Properties

Data given for Sn63Pb37 86% metal, -325+500 mesh

Viscosity (typical): 1000 poise

Malcom viscometer @ 10rpm and 25°C

Initial Tackiness (typical): 45 grams

Tested to J-STD-005, IPC-TM-650, Method 2.4.44

Slump Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.35

Solder Ball Test: Preferred

Tested to J-STD-005, IPC-TM-650, Method 2.4.43

Wetting Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties

Copper Mirror Corrosion: Low

Tested to J-STD-004, IPC-TM-650, Method 2.3.32

Corrosion Test: Low

Tested to J-STD-004, IPC-TM-650, Method 2.6.15

Silver Chromate: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.33

Chloride and Bromides: None Detected

Tested to J-STD-004, IPC-TM-650, Method 2.3.35

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

SIR, IPC (typical): Pass

Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3

Blank

R500

Day 1

1.9

×10

10

1.4

× 10

8

Day 4

1.1

×10

10

2.0

× 10

8

Day 7

8.3

×10

9

8.3

× 10

9

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

(800) 482-4440

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