HMC Electronics HM531 Kester Solder Paste User Manual
Hydromark 531, Product description, Standard applications
HydroMark 531
HydroMark 531
Water-Soluble Solder Paste
Water-Soluble Solder Paste
Product Description
Kester HydroMark 531 is an organic acid, water-
soluble solder paste that provides users with the
highest level of consistency and performance.
Batch after batch, HM531 provides hours of stable
stencil life, tack time and repeatable brick defini-
tion. HM531’s robust printing characteristics result
in consistent solder paste volume regardless of
idle time, stencil life and print speed. The activator
package in the HM531 is very aggressive and
provides superior wetting to OSP-coated PCB’s
and Ag/Pd components.
The outstanding batch consistency, anti-slump
chemistry, consistent print volumes, solderability
and cleanability make the HM531 an ideal
water-soluble solder paste for any application.
• HM531 provides outstanding batch-to-batch
consistency
• Excellent anti-slump characteristics
minimizing bridging defects
• Capable of 60+ minute idle times in printing
• Capable of print speeds up to 150mm/sec
(6in/sec)
• Excellent solderability to a wide variety of
metallizations, including Palladium, leaving
bright, shiny joints
• Residues easily removed with hot DI water,
even up to 48 hours after soldering
• Minimal foam in wash systems
• 8+ hour stencil life
• Classified as ORM0 per J-STD-004
• Produces minimal voiding underneath
BGA components
• Compatible with enclosed print head systems
Standard Applications
90% Metal – Stencil Printing
90% Metal – Enclosed Head Printing
Physical Properties
(Data given for Sn63Pb37, 90% metal, -325+500 mesh)
Viscosity (typical): 1800 poise
Malcom viscometer @ 10rpm and 25°C
Initial Tackiness (typical): 43 grams
Tested to J-STD-005, IPC-TM-650, Method 2.4.44
Slump Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.35
Solder Ball Test: Preferred
Tested to J-STD-005, IPC-TM-650, Method 2.4.43
Wetting Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.45
Reliability Properties
Copper Mirror Corrosion: Low
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test: Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
Silver Chromate: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
Chloride and Bromides: None Detected
Tested to J-STD-004, IPC-TM-650, Method 2.3.35
Fluorides by Spot Test: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
SIR, IPC (typical): Pass
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
Blank
HM531
Day 1
1.9
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1.4
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Day 4
1.1
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2.0
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Day 7
8.3
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8.3
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Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
(800) 482-4440