HMC Electronics EM907 Kester Lead-Free Solder Paste - Manual

EnviroMark EnviroMark TM TM
907 907
Lead-Free No-Clean Solder Paste Lead-Free No-Clean Solder Paste
Product Description
EnviroMark TM 907 is a lead-free, air and nitrogen
reflowable no-clean solder paste specifically
designed for the thermal requirements of lead free
alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The
paste flux system allows joint appearances that
closely resemble that achieved with SnPb alloys.
EM907 is capable of stencil printing downtimes up
to 60 minutes with an effective first print down to
20 mils without any kneading. EM907 also
exhibits excellent continual printability for fine pitch
(0.4mm/16 mils) and is able to print at high speeds
up to 6”/s (150 mm/s). This solder paste also
exceeds the reliability standards required by
J-STD-004.
• Lead free joints that closely resemble those
achieved with SnPb solder paste
• Excellent solderability to a wide variety of
surface metallizations, including Ni/Au, Im Sn
and Im Ag
• High print speeds up to 150 mm/s
• Capable of 60 minute break times in printing
• Stencil life: 12+ hours (process dependent)
• Excellent printing characteristics to 16 and 20
mils pitch
• Excellent print and reflow characteristics for
0201 applications
• Stable tack life
• Classified as ROL0 per J-STD-004
Standard Applications
88.5% Metal – Stencil Printing
RoHS Compliance
This product meets the requirements of the RoHS
(Restriction of Hazardous Substances) Directive,
2002/95/EC Article 4 for the stated banned
substances.
Physical Properties
(Data given for Sn96.5 Ag3.0 Cu0.5, 88.5% metal, -325+500 mesh)
Viscosity (typical): 1800 poise
Malcom viscometer @ 10rpm and 25°C
Initial Tackiness (typical): 44 grams
Tested to J-STD-005, IPC-TM-650, Method 2.4.44
Slump Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.35
Solder Ball Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.43
Wetting Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.45
Reliability Properties
Copper Mirror Corrosion: Low
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test: Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
Silver Chromate: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
Chloride and Bromides: None Detected
Tested to J-STD-004, IPC-TM-650, Method 2.3.35
Fluorides by Spot Test: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
SIR, IPC (typical): Pass
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
Blank EM907
Day 1 1.1
×10
10
Ω
7.7
× 10
8
Ω
Day 4 1.5
×10
10
Ω
1.2
× 10
9
Ω
Day 7 1.4
×10 10 Ω
1.4
× 10 9 Ω
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440