HMC Electronics EM828 Kester Lead-Free Solder Paste - Manual

EnviroMark EnviroMark TM TM
828 828
Low-Voiding Lead-Free Water-Soluble Solder Paste Low-Voiding Lead-Free Water-Soluble Solder Paste
Product Description
Kester EnviroMark TM 828 is a lead-free, water-soluble
solder paste formulated specifically to reduce
voiding behavior that is common with lead-free
solder paste products. EM828 represents a
break-through in water-soluble solder paste
technology with the combination of low voiding,
excellent wetting behavior and ease of cleaning.
Additionally, EM828 is extremely stable in the
stencil printing process, regardless of print speed,
idle time and throughput. EM828 provides
tremendous wetting to a wide variety of board and
component finishes in order to simplify your
transition to lead-free processes.
• Low-voiding underneath area array components
• Excellent wetting on a variety of metallizations
• Residues are easily removed in hot DI water
• Long stencil life and tack time (process
dependent)
• Tremendous brick definition and slump resist-
ance for reduction of bridging defects
• Print speed up to 150 mm/sec (6 in/sec)
• Capable of breaks in printing of up to 60
minutes without any kneading
• Classified as ORH1 per J-STD-004A
Standard Applications
89.5% Metal – Stencil Printing
89.5% Metal – Enclosed Head Printing
RoHS Compliance
This product meets the requirements of the RoHS
(Restriction of Hazardous Substances) Directive,
2002/95/EC Article 4 for the stated banned
substances.
Physical Properties
(Data given for Sn96.5 Ag3.0 Cu0.5, 89.5% metal, -325+500 mesh)
Viscosity (typical): 1700 poise
Malcom viscometer @ 10rpm and 25°C
Initial Tackiness (typical): 40 grams
Tested to J-STD-005, IPC-TM-650, Method 2.4.44
Slump Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.35
Solder Ball Test: Preferred
Tested to J-STD-005, IPC-TM-650, Method 2.4.43
Wetting Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.45
Reliability Properties
Copper Mirror Corrosion: High
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test: Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
SIR, IPC (typical): Pass
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
Blank EM828
Day 1 1.5
×10 9 Ω
9.0
× 10 8 Ω
Day 4 1.3
×10
9
Ω
9.8
× 10
8
Ω
Day 7 9.5 ×10 8 Ω 1.2 × 10 9 Ω
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440