Document Outline

• PRECAUTIONS TO BE OBSERVED BEFORE AND DURING SERVICING TO AVOID POSSIBLE EXPOSURE TO EXCESSIVE MICROWAVE ENERGY
• WARNING TO SERVICE PERSONNEL
  • [1] Before Servicing
  • [2] When the testing is completed,
  • [3] After repairing
• MICROWAVE MEASUREMENT PROCEDURE
  • [1] Requirements:
  • [2] Preparation for testing:
  • [3] Leakage test:
• FOREWORD AND WARNING
  • [1] FOREWORD
  • [2] WARNING
  • [3] DANGER
• PRODUCT DESCRIPTION
  • [1] SPECIFICATIONS
• GENERAL INFORMATION
  • [1] GROUNDING INSTRUCTIONS
  • [2] OVEN DIAGRAM
    • 1. OVEN
    • 2. TOUCH CONTROL PANEL
• OPERATION
  • [1] DESCRIPTION OF OPERATING SEQUENCE
    • 1. OFF CONDITION
    • 2. COOKING CONDITION
    • 3. POWER LEVEL P-0 TO P-90 COOKING
    • 4. POWER OUTPUT REDUCTION
  • [2] OVEN SCHENATIC
    • 1. Off Condition
    • 2. Cooking Condition
  • [3] DESCRIPTION AND FUNCTION OF COMPONENTS
    • 1. DOOR OPEN MECHANISM
    • 2. DOOR SENSING AND SECONDARY INTERLOCK SWITCHES
    • 3. MONITOR SWITCH
    • 4. TURNTABLE MOTOR
    • 5. COOLING FAN MOTOR
    • 6. MAGNETRON TEMPERATURE FUSE
    • 7. THERMAL CUT-OUT (OVEN)
    • 8. MONITOR FUSE
    • 9. NOISE FILER
• TROUBLESHOOTING GUIDE
  • [1] TROUBLESHOOTING CHART
• TEST PROCEDURES
  • [1] Procedure A : MAGNETRON ASSEMBLY TEST
    • 1. MICROWAVE OUTPUT POWER
  • [2] Procedure B : POWER TRANSFORMER TEST
  • [3] Procedure C : HIGH VOLTAGE RECTIFIER TEST
  • [4] Procedure D : HIGH VOLTAGE CAPACITOR TEST
  • [5] Procedure E : TEMPERATURE FUSE OR THERMAL CUT-OUT TEST
  • [6] Procedure F : SECONDARY INTERLOCK SWITCH TEST
  • [7] Procedure F : PRIMARY INTERLOCK SYSTEM TEST
    • 1. DOOR SENSING SWITCH
    • 2. PRIMARY INTERLOCK RELAY (RY2)
  • [8] Procedure G : MONITOR SWITCH TEST
  • [9] Procedure H : BLOWN MINITOR FUSE TEST
  • [10] Procedure I : NOISE FILTER TEST
  • [11] Procedure J : TOUCH CONTROL PANEL ASSEMBLY TEST
    • 1. Key Unit
    • 2. Control Unit.
    • 3. If the Key unit or control unit is defective.
    • 4. When testing is completed,
  • [12] Procedure K : KEY UNIT TEST
  • [13] Procedure L : RELAY TEST
  • [14] Procedure M : DEFROST TEST
  • [15] Procedure N : FOIL PATTERN ON THE PRINTED WIRING BOARD TEST
• TOUCH CONTROL PANEL ASSEMBLY
  • [1] OUTLINE OF TOUCH CONTROL PANEL
    • 1. Key Unit
    • 2. Control Unit
  • [2] DESCRIPTION OF LSI
  • [3] SERVICING FOR TOUCH CONTROL PANEL
    • 1. Precautions for Handling Electronic Components
    • 2. Servicing of Touch Control Panel
    • 3. Servicing Tools
    • 4. Other Precautions
• PRECAUTIONS FOR USING LEAD-FREE SOLDER
  • [1] Employing lead-free solder
  • [2] Using lead-free wire solder
  • [3] Soldering
• COMPONENT REPLACEMENT AND ADJUSTMENT PROCEDURE
  • [1] WARNINGS
  • [2] OUTER CASE REMOVAL
  • [3] POWER TRANSFORMER REMOVAL
    • 1. REMOVAL
    • 2. REINSTALLATION
  • [4] HIGH VOLTAGE COMPONENTS REMOVAL(HIGH VOLTAGE CAPACITOR AND HIGH VOLTAGE RECTIFIER ASSEMBLY)
  • [5] MAGNETRON REMOVAL
    • 1. REMOVAL
    • 2. REINSTALLATION
  • [6] POSITIVE LOCK CONNECTOR (NO-CASE TYPE) REMOVAL
  • [7] CONTROL PANEL ASSEMBLY REMOVAL
  • [8] GRAPHIC SHEET AND MEMBRANE SWITCH REPLACEMENT
    • 1. REMOVAL
    • 2. REINSTALLATION
  • [9] TURNTABLE MOTOR REMOVAL
  • [10] COOLING FAN MOTOR REMOVAL
    • 1. REMOVAL
    • 2. INSTALLATION
  • [11] POWER SUPPLY CORD REPLACEMENT
    • 1. REMOVAL
    • 2. INSTALL
  • [12] DOOR SENSING SWITCH/SECONDARY INTERLOCK SWITCH AND MONITOR SWITCH REMOVAL
    • 1. REMOVAL
    • 2. REINSTALL
  • [13] DOOR SENSING SWITCH/SECONDARY INTERLOCK SWITCH AND MONITOR SWITCH ADJUSTMENT
    • 1. Adjustment
    • 2. After adjustment, check the following.
  • [14] DOOR REPLACEMENT
    • 1. REMOVAL
    • 2. REINSTALL
    • 3. After any service, make sure of the following:
    • 4. SEALER FILM
• CIRCUIT DIAGRAMS
  • [1] Pictorial Diagram (Figure S-1)
  • [2] Control Unit Circuit (Figure S-2)
  • [3] Printed Wiring Board of Power Unit(Figure S-3)
• OVEN PARTS
• DOOR AND CONTROL PANEL PARTS