Henkel 3609TM User Manual

Henkel Tools

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Technical Data Sheet

3609™

March

-

2009

PRODUCT DESCRIPTION

3609™ provides the following product characteristics:

Technology

Epoxy

Chemical Type

Epoxy

Appearance (uncured)

Dark, red viscous gel

LMS

Components

One component - requires no mixing

Cure

Heat cure

Application

Surface mount adhesive

Key Substrates

SMD components to PCB

Other Application Areas Small parts bonding
Dispense Method

Syringe

Dispense Speed

Medium 15,000 -25,000 dots/h

Wet Strength

High

3609™ is designed for the bonding of surface mounted devices

to printed circuit boards prior to wave soldering. Particularly

suited for applications where medium to high dispense speeds,

high dot profile, high wet strength and good electrical

characteristics

are

required.

3609™

has

been

used

successfully in lead free processes with water and alcohol

based fluxes under conditions outlined in the Environmental

Resistance section.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity @ 25 °C

1.2

Particle Size, µm

<150

Flash Point - See MSDS
Yield Point, 25 °C, Pa

Cone & Plate Rheometer:

Haake PK 100, M10/PK 1 2° Cone

250 to 700

LMS

Casson Viscosity @ 25 °C, Pa∙s

Cone & Plate Rheometer:

Haake PK 100, M10/PK 1 2° Cone

0.16 to 2.0

VISCOSITY VS. TEMPERATURE

The following graph shows a typical temperature-viscosity

curve as measured using a Haake rotoviscometer PK100,

M10/PK1 2° Cone system at a shear rate of 2 s

-1

which is

representative of the shear rate in the dispense nozzle.

Increased cabin or nozzle temperature in the 30°C to 35°C

range may aid dispense performance at higher dispense

speeds.

Viscosity, Pa∙s

Temperature, °C

400

300

200

100

0

20

25

30

35

TYPICAL CURING PERFORMANCE

Recommended conditions for curing are exposure to heat

above 100 °C (typically 90-120 seconds @ 150 °C). Rate of

cure and final strength will depend on the residence time at the

cure temperature.

Cure Speed vs. Time, Temperature

The following graph shows the rate of torque strength

developed with time at different temperatures. These times are

defined from the moment the adhesive reaches cure

temperature. In practice, total oven time may be longer to allow

for heat up period. Strength is measured on 1206 capacitors @

22 °C, tested according to IPC SM817, TM-650 Method 2.4.42.

% of Full Strength

Time at Temperature, minutes

100

75

50

25

0

0

1

2

3

4

5

6

7

8

9

10

150°C

125°C

100°C

TYPICAL PROPERTIES OF CURED MATERIAL

Cured for 30 minutes @ 150 °C

Physical Properties:

Coefficient of Thermal Expansion,

ISO 11359-2, K

-1

145×10

-6

Coefficient of Thermal Conductivity, ISO 8302,

W/(m·K)

0.4

Glass Transition Temperature, ASTM D 4065, °C

73

Specific Heat, kJ/(kg·K)

0.3

Density, BS 5350-B1 @ 25 °C, g/cm³

1.4

Electrical Properties:

Surface Resistivity, IEC 60093, Ω

2×10

15

Volume Resistivity, IEC 60093, Ω·cm

2×10

15

Surface Insulation Resistance, Ω:

SN 59651:

Initial

0.1×10

9

Aged for 4 days @ 40 °C, 93 % RH

10×10

9

Aged for 21 days @ 40 °C, 93 % RH

1×10

9

Electrolytic Corrosion, DIN 53489

AN-1.2

Dielectric Constant / Dissipation Factor, IEC 60250:

1

-

kHz

3.7 / 0.009

10

-

kHz

3.3 / 0.03

1,000

-

kHz

3.2 / 0.03

10,000

-

kHz

3.1 / 0.03

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