Document Outline

• MVME55006E Single Board Computer
• Contents
• About this Manual
  • Overview of Contents
  • Conventions
  • Summary of Changes
• Hardware Preparation and Installation
  • 1.1 Overview
  • 1.2 Introduction
  • 1.3 Declaration of Conformity
  • 1.4 Getting Started
  • 1.5 Overview of Startup Procedures
  • 1.6 Unpacking Guidelines
  • 1.7 Configuring the Hardware
    • 1.7.1 Configuring the Board
    • 1.7.2 Ethernet 2, PMC/SBC Mode, and P2 I/O Selection Headers (J6, J7, J28, J32, J34, J97 – J110)
      • 1.7.2.1 Ethernet
      • 1.7.2.2 PMC/SBC Mode Selection
      • 1.7.2.3 P2 I/O Selection
    • 1.7.3 Flash Boot Bank Select Header (J8)
    • 1.7.4 Flash 0 Programming Enable Switch (S3-1)
    • 1.7.5 Safe Start ENV Switch (S5-1)
    • 1.7.6 Flash 0 Block Write Protect Switch (S3-2)
    • 1.7.7 SROM Initialization Enable Switch (S5-2)
    • 1.7.8 PCI Bus 0.0 Speed Switch (S4-1)
    • 1.7.9 VME SCON Select Header (J27)
    • 1.7.10 PCI Bus 1.0 Speed Switch (S4-2)
    • 1.7.11 EEPROM Write Protect Switch (S3-3)
    • 1.7.12 Setting the PMC Vio Keying Pin
  • 1.8 Installing the RAM5500 Module
  • 1.9 Installing PMCs
    • 1.9.1 Mounting the PMC Module
    • 1.9.2 Primary PMCspan
    • 1.9.3 Secondary PMCspan
  • 1.10 Installing the Board
    • 1.10.1 Connection to Peripherals
    • 1.10.2 Completing the Installation
  • 1.11 Startup and Operation
  • 1.12 Applying Power
  • 1.13 Switches and Indicators
• Functional Description
  • 2.1 Overview
  • 2.2 Block Diagram
  • 2.3 Features
  • 2.4 Processor
  • 2.5 L3 Cache
  • 2.6 System Controller
    • 2.6.1 CPU Bus Interface
    • 2.6.2 Memory Controller Interface
    • 2.6.3 Interrupt Controller
    • 2.6.4 I2C Serial Interface and Devices
    • 2.6.5 Direct Memory Access (DMA)
    • 2.6.6 Timers
  • 2.7 Flash Memory
  • 2.8 System Memory
  • 2.9 PCI Local Buses and Devices
    • 2.9.1 Gigabit Ethernet Interface
    • 2.9.2 10/100Mb Ethernet Interface
    • 2.9.3 PCI-to-PCI Bridges
    • 2.9.4 PMC Sites
    • 2.9.5 PCI IDSEL Definition
    • 2.9.6 PCI Bus Arbitration
  • 2.10 Asynchronous Serial Ports
  • 2.11 Real Time Clock and NVRAM
  • 2.12 System Control and Status Registers
  • 2.13 Sources of Reset
  • 2.14 VME Interface
  • 2.15 PMC Expansion
  • 2.16 Debug Support
• RAM55006E Memory Expansion Module
  • 3.1 Overview
  • 3.2 Features
  • 3.3 Functional Description
    • 3.3.1 RAM5500 Description
    • 3.3.2 SROM
    • 3.3.3 Clocks
  • 3.4 Memory Expansion Connector Pin Assignments
  • 3.5 RAM5500 Programming Issues
    • 3.5.1 Serial Presence Detect (SPD) Data
• MOTLoad Firmware
  • 4.1 Overview
  • 4.2 Implementation and Memory Requirements
  • 4.3 MOTLoad Commands
    • 4.3.1 Utilities
    • 4.3.2 Tests
    • 4.3.3 Command List
  • 4.4 Using the Command Line Interface
    • 4.4.1 Rules
    • 4.4.2 Help
  • 4.5 Firmware Settings
    • 4.5.1 Default VME Settings
      • 4.5.1.1 CR/CSR Settings
      • 4.5.1.2 Displaying VME Settings
      • 4.5.1.3 Editing VME Settings
      • 4.5.1.4 Deleting VME Settings
      • 4.5.1.5 Restoring Default VME Settings
  • 4.6 Remote Start
• Connector Pin Assignments
  • 5.1 Introduction
  • 5.2 Connectors
    • 5.2.1 Asynchronous Serial Port Connector (J1)
    • 5.2.2 Ethernet Connectors (J2)
    • 5.2.3 IPMC Connector (J3)
    • 5.2.4 PCI/PMC Expansion Connector (J4)
    • 5.2.5 CPU COP Connector (J5)
    • 5.2.6 PMC 1 Interface Connectors (J11, J12, J13, J14)
    • 5.2.7 Boundary Scan Connector (J18)
    • 5.2.8 PMC 2 Interface Connectors (J21, J22, J23, J24)
    • 5.2.9 Asynchronous Serial Port (COM2) Planar Connector (J33)
    • 5.2.10 VMEbus Connectors (P1 & P2) (PMC Mode)
    • 5.2.11 VMEbus Connectors (P1 & P2) (SBC Mode)
    • 5.2.12 Memory Expansion Connector (P4)
  • 5.3 Headers
    • 5.3.1 Ethernet 2, PMC/SBC Mode, and P2 I/O Selection Headers (J6, J7, J28, J32, J34, J97 – J110)
      • 5.3.1.1 Ethernet
      • 5.3.1.2 PMC/SBC Mode Selection
      • 5.3.1.3 P2 I/O Selection
    • 5.3.2 Flash Boot Bank Select Header (J8)
    • 5.3.3 VME SCON Select Header (J27)
• A Specifications
  • A.1 Power Requirements
    • A.1.1 Supply Current Requirements
  • A.2 Environmental Specifications
• B Thermal Validation
  • B.1 Overview
  • B.2 Thermally Significant Components
  • B.3 Component Temperature Measurement
    • B.3.1 Preparation
    • B.3.2 Measuring Junction Temperature
    • B.3.3 Measuring Local Air Temperature
    • B.3.4 Measuring Case Temperature
• C Related Documentation
  • C.1 Artesyn Embedded Technologies - Embedded Computing Documentation
  • C.2 Manufacturers’ Documents
  • C.3 Related Specifications
• Safety Notes
• Sicherheitshinweise