Document Outline

• Hitachi Freedom Storage™ Lightning 9900™ User and Reference Guide
  • © 2003 Hitachi Data Systems Corporation, ALL RIGHTS RESERVED
  • Trademarks
  • Notice of Export Controls
  • Document Revision Level
  • Source Documents for this Revision
  • Preface
    • Microcode Level
    • COMMENTS
  • Contents
  • List of Figures
  • List of Tables
  • Chapter 1 Overview of the Lightning 9900™ Subsystem
    • 1.1 Key Features of the Lightning 9900™ Subsystem
      • 1.1.1 Continuous Data Availability
      • 1.1.2 Connectivity
      • 1.1.3 S/390® Compatibility and Functionality
      • 1.1.4 Open-Systems Compatibility and Functionality
      • 1.1.5 Hitachi Freedom NAS™ and Hitachi Freedom SAN™
      • 1.1.6 Program Products and Service Offerings
        • Table 1.1 Program Products and Service Offerings
      • 1.1.7 Subsystem Scalability
    • 1.2 Reliability, Availability, and Serviceability
  • Chapter 2 Subsystem Architecture and Components
    • 2.1 Overview
      • Figure 2.1 Lightning 9900™ HiStar Network (HSN) Architecture
      • Figure 2.2 9960 Subsystem Frames
      • Figure 2.3 9910 Subsystem Frame
    • 2.2 Components of the Controller Frame
      • 2.2.1 Storage Clusters
      • 2.2.2 Nonvolatile Shared Memory
      • 2.2.3 Nonvolatile Duplex Cache
      • 2.2.4 Multiple Data and Control Paths
      • 2.2.5 Redundant Power Supplies
      • 2.2.6 Client-Host Interface Processors (CHIPs) and Channels
        • Table 2.1 CHIP and Channel Specifications
      • 2.2.7 Channels
      • 2.2.8 Array Control Processors (ACPs)
        • Table 2.2 ACP Specifications
    • 2.3 Array Frame
      • Table 2.3 Disk Drive Specifications
      • 2.3.1 Disk Array Groups
        • Figure 2.5 Sample RAID-1 Layout
        • Figure 2.6 Sample RAID-5 Layout (Data Plus Parity Stripe)
      • 2.3.2 Sequential Data Striping
    • 2.4 Intermix Configurations
      • 2.4.1 RAID-1 & RAID-5 Intermix
      • 2.4.2 Hard Disk Drive Intermix
        • Figure 2.7 Sample Hard Disk Drive Intermix
      • 2.4.3 Device Emulation Intermix
        • Figure 2.8 Sample Device Emulation Intermix
    • 2.5 Service Processor (SVP)
    • 2.6 Remote Console PC
  • Chapter 3 Functional and Operational Characteristics
    • 3.1 New 9900 Features and Capabilities
    • 3.2 I/O Operations
    • 3.3 Cache Management
      • 3.3.1 Algorithms for Cache Control
      • 3.3.2 Write Pending Rate
    • 3.4 Control Unit (CU) Images, LVIs, and LUs
      • 3.4.1 CU Images
      • 3.4.2 Logical Volume Image (LVIs)
      • 3.4.3 Logical Unit (LU) Type
        • Table 3.1 Capacities of Standard LU Types
        • Figure 3.1 Fibre-Channel Device Addressing
    • 3.5 System Option Modes
      • Table 3.2 Common System Option Modes
      • Table 3.3 System Option Modes for Mainframe Connectivity
      • Table 3.4 System Option Modes for Open-System Connectivity
      • Table 3.5 System Option Modes for ShadowImage - S/390® and ShadowImage
      • Table 3.6 System Option Modes for TrueCopy - S/390® Synchronous & Asynchronous
      • Table 3.7 System Option Modes for HXRC
      • Table 3.8 System Option Modes for Concurrent Copy (CC)
    • 3.6 Open Systems Features and Functions
      • 3.6.1 Failover and SNMP Support
      • 3.6.2 Share-Everything Architecture
      • 3.6.3 SCSI Extended Copy Command Support
    • 3.7 Data Management Functions
      • Table 3.9 Data Management Functions for Open-System Users
      • Table 3.10 Data Management Functions for S/390® Users
      • 3.7.1 Hitachi TrueCopy (TC)
      • 3.7.2 Hitachi TrueCopy – S/390® (TC390)
      • 3.7.3 Hitachi ShadowImage (SI)
      • 3.7.4 Hitachi ShadowImage – S/390® (SI390)
      • 3.7.5 Command Control Interface (CCI)
      • 3.7.6 Extended Copy Manager (ECM)
      • 3.7.7 Hitachi Extended Remote Copy (HXRC)
      • 3.7.8 Hitachi NanoCopy™
      • 3.7.9 Data Migration
      • 3.7.10 Hitachi RapidXchange (HRX)
      • 3.7.11 Hitachi Multiplatform Backup/Restore (HMBR)
      • 3.7.12 HARBOR® File-Level Backup/Restore
      • 3.7.13 HARBOR® File Transfer
      • 3.7.14 HiCommand™
      • 3.7.15 LUN Manager
      • 3.7.16 LU Size Expansion (LUSE)
      • 3.7.17 Virtual LVI/LUN
      • 3.7.18 FlashAccess
      • 3.7.19 Cache Manager
      • 3.7.20 Hitachi SANtinel
      • 3.7.21 Hitachi SANtinel – S/390®
      • 3.7.22 Prioritized Port and WWN Control (PPC)
      • 3.7.23 Hitachi Parallel Access Volume (HPAV)
      • 3.7.24 Dynamic Link Manager™ (DLM)
      • 3.7.25 LDEV Guard
      • 3.7.26 Hitachi CruiseControl
      • 3.7.27 Hitachi Graph-Track™
  • Chapter 4 Configuring and Using the 9900 Subsystem
    • 4.1 S/390® Configuration
      • 4.1.1 Subsystem IDs (SSIDs)
        • Table 4.1 SSID Requirements
    • 4.2 S/390® Hardware Definition
      • 4.2.1 Hardware Definition Using IOCP (MVS, VM, or VSE)
        • Figure 4.1 IOCP Definition for FICON™ Channels (direct connect and via FICON™ switch)
        • Figure 4.2 IOCP Definition for 1024 LVIs (9900 connected to host CPU(s) via ESCD)
        • Figure 4.3 IOCP Definition for 1024 LVIs (9900 directly connected to CPU)
        • Table 4.2 Correspondence between Physical Paths and Channel Interface IDs (Cluster 1)
        • Table 4.3 Correspondence between Physical Paths and Channel Interface IDs (Cluster 2)
      • 4.2.2 Hardware Definition Using HCD (MVS/ESA)
        • Table 4.4 HCD Definition for 64 LVIs
        • Table 4.5 HCD Definition for 256 LVIs
        • Figure 4.4 Master MENU (Step 1)
        • Figure 4.5 Basic HCD Panel (Step 2)
        • Figure 4.6 Define, Modify, or View Configuration Data (Step 3)
        • Figure 4.7 Control Unit List Panel (Step 4)
        • Figure 4.9 Selecting the Operating System (Step 6) Goto
        • Figure 4.11 Select Processor / Control Unit Panel (Step 8)
        • Figure 4.12 Control Unit List (Step 9)
        • Figure 4.13 I/O Device List Panel (Step 10)
        • Figure 4.14 Add Device Panel (Step 11)
        • Figure 4.15 Device / Processor Definition Panel – Selecting the Processor ID (Step 12)
        • Figure 4.16 Define Device / Processor Panel (Step 13)
        • Figure 4.17 Device / Processor Definition Panel (Step 14)
        • Figure 4.18 Define Device to Operating System Configuration (Step 15)
        • Figure 4.19 Define Device Parameters / Features Panel (Step 16)
        • Figure 4.20 Update Serial Number, Description and VOLSER Panel (Step 18)
      • 4.2.3 Defining the 9900 to VM/ESA® Systems
      • 4.2.4 Defining the 9900 to TPF
    • 4.3 S/390® Operations
      • 4.3.1 Initializing the LVIs
        • Figure 4.21 LVI Initialization for MVS: ICKDSF JCL
      • 4.3.2 Device Operations: ICKDSF
        • Table 4.6 ICKDSF Commands for 9900 Contrasted to RAMAC
      • 4.3.3 MVS Cache Operations
        • Figure 4.22 Displaying Cache Statistics Using MVS DFSMS
        • Figure 4.23 IDCAMS LISTDATA COUNTS (JCL example)
      • 4.3.4 VM/ESA® Cache Operations
      • 4.3.5 VSE/ESA Cache Operations
    • 4.4 Open-Systems Configuration
      • Table 4.7 9900 Open-System Platforms and Configuration Guides
      • 4.4.1 Configuring the Fibre-Channel Ports
        • Figure 4.24 Fibre Port-to-LUN Addressing
      • 4.4.2 Virtual LVI/LUN Devices
      • 4.4.3 LU Size Expansion (LUSE) Devices
    • 4.5 Open Systems Operations
      • 4.5.1 Command Tag Queuing
      • 4.5.2 Host/Application Failover Support
      • 4.5.3 Path Failover Support
        • Figure 4.25 Alternate Pathing
      • 4.5.4 Remote SIM (R-SIM) Reporting
      • 4.5.5 SNMP Remote Subsystem Management
      • 4.5.6 NAS and SAN Operations
  • Chapter 5 Planning for Installation and Operation
    • 5.1 User Responsibilities
    • 5.2 Electrical Specifications and Requirements for Three-Phase Subsystems
      • 5.2.1 Internal Cable Diagram
        • Figure 5.1 Diagram of Power Plugs for Three-Phase 9960 Disk Array Unit (Europe)
      • 5.2.2 Power Plugs
        • Figure 5.2 Diagram of Power Plugs for Three-Phase 9960 Disk Array Unit (USA)
        • Figure 5.3 Diagram of Power Plugs for Three-Phase 9960 Disk Array Unit (Europe)
      • 5.2.3 Features
        • Table 5.1 9960 Three-Phase Features
      • 5.2.4 Current Rating, Power Plug, Receptacle, and Connector for Three-Phase (60 Hz only)
      • 5.2.5 Input Voltage Tolerances
        • Table 5.3 Input Voltage Specifications for Three-Phase Power
    • 5.3 Electrical Specifications and Requirements for Single-Phase Subsystems
      • 5.3.1 Internal Cable Diagram
        • Figure 5.4 Internal Cable Diagram of a Single-Phase 9960 Subsystem
        • Figure 5.5 Internal Cable Diagram of a Single-Phase 9910 Subsystem
      • 5.3.2 Power Plugs
        • Figure 5.6 Power Plugs for Single-Phase 9960 Controller (USA)
        • Figure 5.7 Power Plugs for Single-Phase 9910 Subsystem (USA)
        • Figure 5.8 Power Plugs for a Single-Phase 9960 Controller (Europe)
        • Figure 5.9 Power Plugs for a Single-Phase 9910 Subsystem (Europe)
        • Figure 5.10 Power Plugs for Single-Phase 9960 Disk Array Unit (USA)
        • Figure 5.11 Power Plugs for Single-Phase 9960 Disk Array Unit (Europe)
      • 5.3.3 Features
        • Table 5.4 9900 Single-Phase Features
      • 5.3.4 Current Rating, Power Plug, Receptacle, and Connector for Single-Phase (60 Hz only)
        • Table 5.5 Current Rating, Power Plug, Receptacle, and Connector for Single-Phase 9900
      • 5.3.5 Input Voltage Tolerances
        • Table 5.6 Input Voltage Specifications for Single-Phase Power
    • 5.4 Dimensions and Weight
      • Figure 5.12 9960 DKC and DKU Physical Dimensions
      • Figure 5.13 9910 DKC and DKU Physical Dimensions
      • Table 5.7 9900 Physical Specifications
      • Table 5.8 9960 Frame and Component Weights
      • Table 5.9 9960 & 9910 Subsystem Weights
    • 5.5 Floor Loading and Cable Routing Requirements
      • 5.5.1 Service Clearance Requirements
        • Figure 5.14 9960 Controller Frame Service Clearance and Cutouts (millimeters)
        • Figure 5.15 9960 Controller Frame Service Clearance and Cutouts (inches)
        • Figure 5.16 9960 Disk Array Unit Service Clearance and Cutout (millimeters)
        • Figure 5.17 9960 Disk Array Unit Service Clearance and Cutout (inches)
      • 5.5.2 Minimum Subsystem Disk Configuration
        • Figure 5.18 9960 Disk Subsystem Minimum Configuration (millimeters)
        • Figure 5.19 9960 Disk Subsystem Minimum Configuration (inches)
        • Figure 5.20 9910 Disk Subsystem All Configurations (millimeters)
        • Figure 5.21 9910 Disk Subsystem All Configurations (inches)
      • 5.5.3 Floor Load Rating
        • Table 5.10 Floor Load Rating for 9910 Subsystem
        • Table 5.11 Floor Load Rating for 9960 Controller with 1 Disk Array
        • Figure 5.22 9960 Disk Subsystem with Controller and 4 Disk Arrays
        • Table 5.12 Floor Load Rating for 9960 Controller with 4 Disk Arrays
        • Figure 5.23 9960 Disk Subsystem with Maximum Configuration
        • Table 5.13 Floor Load Rating for 9960 Controller with Maximum Configuration
      • 5.5.4 Cable Requirements
        • Table 5.14 Cable Requirements
    • 5.6 Channel Specifications and Requirements
      • Table 5.15 ESCON® and FICON™ Port Information
      • Table 5.16 Fibre-Channel Port Information
    • 5.7 Environmental Specifications and Requirements
      • 5.7.1 Temperature and Humidity Requirements
        • Table 5.17 Temperature and Humidity Requirements
      • 5.7.2 Power Consumption and Heat Output Specifications
        • Table 5.18 9910/9960 Component Power and Heat Output Specifications
        • Table 5.19 9900 Subsystem Power and Heat Output Specifications
      • 5.7.3 Loudness
      • 5.7.4 Air Flow Requirements
        • Table 5.20 Internal Air Flow
      • 5.7.5 Vibration and Shock Tolerances
        • Table 5.21 Vibration and Shock Tolerances
  • Chapter 6 Troubleshooting
    • 6.1 Troubleshooting
      • Table 6.1 Troubleshooting
    • 6.2 Service Information Messages (SIMs)
      • Figure 6.1 Typical 9900 SIM Showing Reference Code and SIM Type
    • 6.3 Calling the Hitachi Data Systems Support Center
  • Appendix A Unit Conversions
    • Table A.1 Unit Conversions for Standard (U.S.) and Metric Measures
  • Acronyms and Abbreviations