Document Outline

• mn-pcb4300_r2.pdf
  • INSIDE COVER
  • Table of Contents
  • Tables
  • Figures
  • PREFACE
    • About this Manual
      • Reporting Comments or Suggestions Concerning this Manual
    • Conventions and References
      • Cautions and Warnings
      • Recommended Standard Designations
      • Trademarks
      • Metric Conversion
    • Electrical Safety Notice
    • Warranty Policy
      • Limitations of Warranty
      • Exclusive Remedies
    • Customer Support
      • Online Customer Support
  • Chapter 1. INTRODUCTION
    • 1.1 Overview
    • 1.2 Functional Description
    • 1.3 Theory of Operation
      • 1.3.1 Phase and Gain Equalization
      • 1.3.2 System Switching
      • 1.3.3 System Gain
      • 1.3.4 System Attenuation
    • 1.4 Dimensional Envelope
  • Chapter 2. EXTERNAL CONNECTORS
    • 2.1 Overview
    • 2.2 Monitor and Control (M&C) Interface Connectors
      • 2.2.1 SYSTEM COM J1 Connector
      • 2.2.2 SSPA COM 1 J2, SSPA COM 2 J3, SSPA COM 3 J4 Connectors
      • 2.2.3 SSPA SW OUT J5 Connector
      • 2.2.4 RF INPUT SWITCH J6 Connector
    • 2.3 RF Interface Connectors
      • 2.3.1 RF IN 1 J7, RF IN 2 J8 Connectors
      • 2.3.2 SSPA OUT 1 J9 Connector
      • 2.3.3 SSPA OUT 2 J10, SSPA OUT 3 J11 Connectors
    • 2.4 Power and Ground Interfaces
      • 2.4.1 AC Power
      • 2.4.2 Ground Connector
  • Chapter 3. OPERATION and ADJUSTMENT PROCEDURES
    • 3.1 Overview
    • 3.2 System Assembly Example and Cable Connections
      • 3.2.1 Installation
      • 3.2.2 LED Status Operation
    • 3.3 System Verification
      • 3.3.1 System Gain Verification
      • 3.3.2 System P1dB Verification
    • 3.4 Single Frequency Alignment (as necessary)
      • 3.4.1 Gain Equalization
      • 3.4.2 Phase Equalization
    • 3.5 Full Bandwidth Alignment (as necessary)
      • 3.5.1 Gain Equalization
      • 3.5.2 Phase Equalization
  • Chapter 4. FLASH UPGRADING
    • 4.1 Overview
    • 4.2 Flash Updating via Internet
      • 4.2.1 Firmware File Transfer Procedure
    • 4.3 Flash Upgrade Procedure
  • Appendix A. ASSEMBLY KITS
    • A.1 Overview
    • A.2 Common Assembly Items
      • A.2.1 Universal Pole Mounting Kit PL/12319-1
      • A.2.2 Dual-Channel Unistrut Mounting Kit KT-0000017
      • A.2.3 HPOD Unistrut Mounting Kit KT/12300-1
    • A.3 PCB-4300 Phase Combiner in Assemblies
    • A.4 PCB-4300 Ku-Band Unit (PL/11285-2) Assemblies
      • A.4.1 Ku-Band 1:2 Phase Combined System Assembly – HPOD PL-0000317
        • A.4.1.1 Ku-Band 1:2 Phase Combined System – Waveguides and Components Kit KT-0000026
      • A.4.2 Ku-Band 1:2 Phase Combined System Kit KT/11830-1 (Legacy Item)
        • A.4.2.1 Ku-Band 1:2 Phase Combined System Kit KT/11830-1 – Assembly Examples
    • A.5 PCB-4300 C-Band Unit (PL-0000582) Assemblies
      • A.5.1 C-Band 1:2 Phase Combined Top Assembly Kit – 350W HPOD (CEFD P/N KT-0000109)
        • A.5.1.1 C-Band 1:2 Phase Combined System Waveguide Kit – HPOD (CEFD P/N KT-0000107)
  • Appendix B. REMOTE CONTROL
    • B.1 Overview
    • B.2 EIA-485
    • B.3 EIA-232
    • B.4 Basic Protocol
    • B.5 Packet Structure
      • B.5.1 Start Of Packet
      • B.5.2 Target (Base) Address
        • B.5.2.1 Virtual Address
      • B.5.3 Address Delimiter
      • B.5.4 Instruction Code
      • B.5.5 Instruction Code Qualifier
      • B.5.6 Optional Message Arguments
      • B.5.7 End Of Packet
    • B.6 Remote Commands / Queries
  • METRIC CONVERSIONS
• BACK COVER