Document Outline

• HDP5000 & HDPii Plus User Guide
  • Contents
• 1 Specifications
  • 1.1 Regulatory Compliance
    • 1.1.1 Agency Listings
    • 1.1.2 United States
    • 1.1.3 Canada
    • 1.1.4 Taiwan
    • 1.1.5 Japan
    • 1.1.6 Korean
  • 1.2 Safety Messages (review carefully)
    • 1.2.1 Taiwan
    • 1.2.2 China
  • 1.3 Technical Specifications
• 2 Setup and Installation Procedures
  • 2.1 Inspection – Card Printer
• 3 Printer Driver Operations
  • 3.1 Using the Card tab
    • 3.1.1 Selecting the Card Size
    • 3.1.2 Selecting the Card Type
    • 3.1.3 Setting the Orientation
    • 3.1.4 Card Hopper Selection
    • 3.1.5 Specifying the Number of Copies
    • 3.1.6 Selecting the Diagnostics button
    • 3.1.7 Printing a Test Print Image
    • 3.1.8 Selecting About
    • 3.1.9 Selecting the Toolbox button
  • 3.2 Selecting the Configuration tab
    • 3.2.1 Using the Event Monitoring Group Box
    • 3.2.2 Reviewing the Ribbon Low message
    • 3.2.3 Reviewing the Laminate Low Message
    • 3.2.4 Using the InTM Film Low message
    • 3.2.5 Using the Clean Printer message
    • 3.2.6 Using the Error Status message
    • 3.2.7 Using the Password Prompt message
    • 3.2.8 Selecting the Display Language
  • 3.3 Selecting the Calibrate Laminator tab
  • 3.4 Selecting the Calibrate Film tab
  • 3.5 Selecting the Calibrate Ribbon tab
  • 3.6 Selecting the Clean Printer tab
    • 3.6.1 Using Clean Printer Group
  • 3.7 Selecting the Advanced Settings tab
    • 3.7.1 Using the Image Darkness Setting
    • 3.7.2 Using the Print Top of Form Setting
    • 3.7.3 Using the Print Left of Form Setting
    • 3.7.4 Using the Mag Top of Form Setting
    • 3.7.5 Using the Print Flip Angle Setting
    • 3.7.6 Using the Print Flip Level Setting
    • 3.7.7 Using the Encoder Flip Angle Setting
    • 3.7.8 Setting the Printhead Resistance
    • 3.7.9 Using the Transfer TOF Setting
    • 3.7.10 Using the Transfer Temp Offset Setting
    • 3.7.11 Using the Ribbon Print Take-up Tension Setting
    • 3.7.12 Using the InTM Film Print Take-up Tension Setting
    • 3.7.13 Using the Ribbon Print Supply Tension Setting
    • 3.7.14 Using the Film Supply Transfer Tension Setting
    • 3.7.15 Using the Film Takeup Transfer Tension Setting
    • 3.7.16 Using the Resin Heat Adjust Setting
    • 3.7.17 Using the Sleep Time Setting
    • 3.7.18 Using the Standby Time Setting
    • 3.7.19 Using the Blush Point Setting
    • 3.7.20 Using the LCD Contrast Setting
    • 3.7.21 Using the Cleaning Rate Setting
    • 3.7.22 Using the EAT Disable Setting
    • 3.7.23 Using the InTM Film Print Cooling Level Setting
    • 3.7.24 Using the InTM Film Transfer Cooling Level Setting
    • 3.7.25 Using the Enable Ribbon Wrinkle Compensation Setting
    • 3.7.26 Using the Holo Transfer Offset Setting
    • 3.7.27 Using the Standby Temp Setting
    • 3.7.28 Using the Mag Hi-Co Voltage Offset Setting
    • 3.7.29 Using the Mag Lo-Co Voltage Offset Setting
    • 3.7.30 Using the Mag Flipper Angle Offset Setting
    • 3.7.31 Using the Lamination Top of Form Setting
    • 3.7.32 Using the Lamination End of Form Setting
    • 3.7.33 Using the Lamination Bottom Takeup Setting
    • 3.7.34 Using the Lamination Top Takeup Setting
    • 3.7.35 Using the Lamination Card Backup Setting
    • 3.7.36 Using the Lamination Card Length Setting
    • 3.7.37 Using the I Panel Heat Offset
    • 3.7.38 Reviewing the No Printer Connected Error Message
    • 3.7.39 Reviewing the Value Outside the Range Error Message
  • 3.8 Using the Device Options tab
    • 3.8.1 Detecting Supplies at Print Time Function
    • 3.8.2 Adjusting the Ribbon Type
    • 3.8.3 Adjusting the (InTM) Film Type
  • 3.9 Using the Dual Sided Group Functions
    • 3.9.1 Using the Dual Sided - Print Both Sides option
    • 3.9.2 Using the Print Both Sides - Split 1 Set of Ribbon Panels option
    • 3.9.3 Using Print Both Sides - Print Back Image on Front of Card
    • 3.9.4 Using the Dual Sided - Print Back Side Only option
    • 3.9.5 Using the Options Group
      • 3.9.5.1 Using the Rotate 180 Degrees (Front or Back)
      • 3.9.5.2 Using the Disable printing option
      • 3.9.5.3 Using the Dual Pass and Invert F-Panel Image options
    • 3.9.6 Using Secure Resin Erase
    • 3.9.7 Using the Encrypt Job Data
    • 3.9.8 Using the Use Substitute Panel Data
      • 3.9.8.1 YMCFK Ribbon
      • 3.9.8.2 YMCKI Ribbon
    • 3.9.9 Use Substitute Panel Data - Disabled (Current driver)
      • 3.9.9.1 YMCFK Ribbon
      • 3.9.9.2 Split Ribbon ON (Duplex)
      • 3.9.9.3 Split Ribbon OFF (Duplex)
      • 3.9.9.4 Split Ribbon OFF (Simplex)
      • 3.9.9.5 YMCKI Ribbon
    • 3.9.10 Using Print Mode
  • 3.10 Using the Image Color tab
    • 3.10.1 Using the Image Quality – Color Matching
    • 3.10.2 Adjusting for the Resin Dither
    • 3.10.3 Using the Advanced Image Color window
  • 3.11 Using the Image Transfer tab
    • 3.11.1 Adjusting the Image Position controls
    • 3.11.2 Adjusting the Transfer Dwell Time and Temperature
  • 3.12 Using the Magnetic Encoding tab
    • 3.12.1 Use the Encoding Mode option to specify the magnetic encoding
    • 3.12.2 Selecting the Coercivity/Magnetic Track
    • 3.12.3 Reviewing the Shift Data Left Function
    • 3.12.4 Using the Character Size buttons
    • 3.12.5 Using the ASCII Offset dropdown list
    • 3.12.6 Using the Bit Density dropdown list
    • 3.12.7 Using the LRC Generation dropdown list
    • 3.12.8 Using the Character Parity Mode dropdown list
    • 3.12.9 Reviewing the ISO Track Locations
    • 3.12.10 Sending the Track Information
      • 3.12.10.1 Reviewing the Sample String
    • 3.12.11 Reviewing the ASCII Code and Character Table
    • 3.12.12 Using the Default button
  • 3.13 Using the Lamination tab
    • 3.13.1 Selecting the Lamination Position
    • 3.13.2 Adjusting the Lamination Speed - Transfer Dwell Time
    • 3.13.3 Selecting the Lamination Side dropdown menu
    • 3.13.4 Selecting the Lamination Type
    • 3.13.5 Selecting the Defaults button
    • 3.13.6 Selecting the Auto Detect Laminate button
  • 3.14 Using the K Panel Resin tab
    • 3.14.1 Using the Click and Drag capability
    • 3.14.2 Selecting “inches or mm” radio button
    • 3.14.3 Using the Add and Delete buttons
    • 3.14.4 Selecting the Full Card
    • 3.14.5 Selecting the Defined Area(s)
    • 3.14.6 Selecting the Undefined Area(s)
    • 3.14.7 Defining the Area to activate the Card Grid
    • 3.14.8 Selecting the Print YMC under the K and Print K Only options
  • 3.15 Using the Printer Supplies tab
• 4 General Troubleshooting
  • 4.1 Troubleshooting - LCD and Printer Error Message Tables
    • 4.1.1 How to use the LCD Error Message Table
    • 4.1.2 Troubleshooting with the LCD Error Message
    • 4.1.3 Troubleshooting - Printer Error Messages
    • 4.1.4 Communications Errors
• 5 Card Lamination Module
  • 5.1 Printer Unit: Reviewing the Card Lamination Module
    • 5.1.1 Adjusting the Lamination Placement on the Card
• 6 Printer Adjustments
  • 6.1 Printing on Alternate Card Stocks
    • 6.1.1 Selecting the Right Cards and optimizing the HDP Print Process
    • 6.1.2 Conducting the Tape Adhesion Test
• 7 Cleaning
  • 7.1 Using the Required Supplies
  • 7.2 Accessing the Clean Printer tab
    • 7.2.1 Cleaning the Printer Platen Roller and Card Feed Rollers
    • 7.2.2 Cleaning inside the Printer
    • 7.2.3 Cleaning outside the Printer
    • 7.2.4 Cleaning the Printhead
    • 7.2.5 Replacing the Card Cleaning Roller
    • 7.2.6 Cleaning the Magnetic Encoder when installed in the Printer
• 8 Workbench Printer Utility
  • 8.1 Reviewing the Card tab and Diagnostic button
• 9 Fluorescent Panel Usage
  • 9.1 Configuring Fluorescent Data using Workbench
  • 9.2 Configuring Fluorescent Data (F-Panel for YMCFK Ribbon)
• 10 Inhibit Panel Usage
  • 10.1 Using Inhibit Panel (Workbench Printer Utility)
    • 10.1.1 Using Inhibit Panel with an Application
    • 10.1.2 Generating Text Objects
    • 10.1.3 Rendering Print Jobs
    • 10.1.4 Using the Test Print
    • 10.1.5 Troubleshooting the Inhibit Panel
• 11 Firmware Updates
  • 11.1 Performing the Firmware Updates
• 12 Appendix A: HDPii plus
  • 12.1 Accessory Procedures - Using the Security Lock Slot
    • 12.1.1 Cleaning the Magnetic Encoder - HDPii Output Module