Document Outline

• Front cover
• Contents
• Notices
  • Trademarks
• Preface
  • The team that wrote this Redpaper
  • Become a published author
  • Comments welcome
• Chapter 1. General description
  • 1.1 System specifications
  • 1.2 Physical package
  • 1.3 Minimum and optional features
    • 1.3.1 Processor card features
    • 1.3.2 Memory features
    • 1.3.3 Disk and media features
    • 1.3.4 USB diskette drive
    • 1.3.5 I/O drawers
    • 1.3.6 Hardware Management Console models
  • 1.4 Value Paks
  • 1.5 Model type conversion
  • 1.6 System racks
    • 1.6.1 IBM RS/6000 7014 Model T00 Enterprise Rack
    • 1.6.2 IBM RS/6000 7014 Model T42 Enterprise Rack
    • 1.6.3 AC Power Distribution Unit and rack content
    • 1.6.4 Rack-mounting rules for p5-570 and I/O drawers
    • 1.6.5 Additional options for rack
    • 1.6.6 OEM rack
  • 1.7 Statement of direction
• Chapter 2. Architecture and technical overview
  • 2.1 The POWER5 chip
    • 2.1.1 Simultaneous multi-threading
    • 2.1.2 Dynamic power management
    • 2.1.3 The POWER chip evolution
    • 2.1.4 CMOS, copper, and SOI technology
  • 2.2 Processor cards
    • 2.2.1 Processor drawer interconnect cables
    • 2.2.2 Processor clock rate
  • 2.3 Memory subsystem
    • 2.3.1 Memory placement rules
    • 2.3.2 Memory restriction
    • 2.3.3 Memory throughput
  • 2.4 System buses
    • 2.4.1 RIO-2 buses and GX+ card
    • 2.4.2 SP bus
  • 2.5 Internal I/O subsystem
    • 2.5.1 PCI-X slots and adapters
    • 2.5.2 LAN adapters
    • 2.5.3 Graphic accelerators
    • 2.5.4 SCSI adapters
  • 2.6 Internal storage
    • 2.6.1 Internal hot swappable SCSI disks
    • 2.6.2 Internal RAID options
    • 2.6.3 Internal media devices
  • 2.7 External I/O subsystems
    • 2.7.1 I/O drawers
    • 2.7.2 7311 Model D10 and 7311 Model D11 I/O drawers
    • 2.7.3 7311 Model D20 I/O drawer
    • 2.7.4 7311 I/O drawer and RIO-2 cabling
    • 2.7.5 7311 I/O drawer and SPCN cabling
    • 2.7.6 External disk subsystems
  • 2.8 Dynamic logical partitioning
  • 2.9 Virtualization
    • 2.9.1 Virtual Ethernet
    • 2.9.2 Advanced POWER Virtualization feature
  • 2.10 Service processor
    • 2.10.1 Service processor - base
    • 2.10.2 Service processor - extender
  • 2.11 Boot process
    • 2.11.1 IPL flow without an HMC attached to the system
    • 2.11.2 Hardware Management Console
    • 2.11.3 IPL flow with an HMC attached to the system
    • 2.11.4 Definitions of partitions
    • 2.11.5 Hardware requirements for partitioning
    • 2.11.6 Specific partition definitions used for Micro-Partitioning
    • 2.11.7 System Management Services
    • 2.11.8 Boot options
    • 2.11.9 Additional boot options
    • 2.11.10 Security
  • 2.12 Operating system requirements
    • 2.12.1 AIX 5L
    • 2.12.2 Linux
• Chapter 3. Capacity on Demand, RAS, and manageability
  • 3.1 Capacity on Demand
    • 3.1.1 Processor Capacity Upgrade on Demand methods
    • 3.1.2 Capacity Upgrade on Demand for memory
    • 3.1.3 How to report temporary activation resources
    • 3.1.4 Trial Capacity on Demand
  • 3.2 Reliability, availability, and serviceability
    • 3.2.1 Fault avoidance
    • 3.2.2 First Failure Data Capture
    • 3.2.3 Permanent monitoring
    • 3.2.4 Self-healing
    • 3.2.5 N+1 redundancy
    • 3.2.6 Fault masking
    • 3.2.7 Resource deallocation
    • 3.2.8 Serviceability
  • 3.3 Manageability
    • 3.3.1 Advanced System Management Interface
    • 3.3.2 Service Agent
    • 3.3.3 p5 Customer-Managed Microcode
    • 3.3.4 Service Update Management Assistant
  • 3.4 Cluster 1600
• Related publications
  • IBM Redbooks
  • Other publications
  • Online resources
  • How to get IBM Redbooks
  • Help from IBM
• Back cover