Document Outline

• 1 About This Manual
  • 1.1 Scope
  • 1.2 Validity
  • 1.3 Cautions and Notes
• 2 Safety Instructions
• 3 Description
  • 3.1 Application
  • 3.2 System Overview
  • 3.3 Product Range
    • 3.3.1 Part Numbers
    • 3.3.2 Chassis
    • 3.3.3 KVM Extender Modules
    • 3.3.4 Upgrade Modules
    • 3.3.5 Devices for free configuration
  • 3.4 Accessories Upgrade Kits
  • 3.5 Accessories
  • 3.6 Device Views
    • 3.6.1 2-fold Vario Chassis 474-BODY2/2R
    • 3.6.2 2-fold Vario Chassis 474-BODY2N
    • 3.6.3 4-fold Vario Chassis 474-BODY4/4R
    • 3.6.4 6-fold Vario Chassis 474-BODY6R
    • 3.6.5 6-fold Vario Chassis 474-BODY6BP
    • 3.6.6 21-fold Vario Chassis 474-BODY21R
    • 3.6.7 Model L- / R474-BDHC / -B2HC
    • 3.6.8 Model L- / R474-BDHS/X / -B2HS/X
    • 3.6.9 Model L- / R474-BDHCR / -B2HCR
    • 3.6.10 Model L- / R474-BDHS/XR / -B2HS/XR
    • 3.6.11 Model L- / R474-BXH
    • 3.6.12 Model L- / R474-BXE
    • 3.6.13 Model L- / R474-BUE
    • 3.6.14 Model L- / R474-BAX
    • 3.6.15 Model L- / R474-BAP
    • 3.6.16 Model L- / R474-BXP
    • 3.6.17 Model L- / R474-BDX
    • 3.6.18 Model L- / R474-BAH
    • 3.6.19 Model L- / R474-BDH
    • 3.6.20 Model L- / R474-BAE
    • 3.6.21 Model L- / R474-BDE
    • 3.6.22 Model L- / R474-BDD
    • 3.6.23 Modell L- / R474-BDA
    • 3.6.24 Modell L- / R474-BXTC
    • 3.6.25 Modell L- / R474-BXTS
  • 3.7 Status LEDs
    • 3.7.1 Status KVM Extender Module
    • 3.7.2 Status Upgrade Module Digital Audio
    • 3.7.3 Status Upgrade Module USB-HID
    • 3.7.4 Status Upgrade module USB 2.0 embedded
    • 3.7.5 Status Upgrade Module USB 2.0
• 4 Installation
  • 4.1 Package Contents
  • 4.2 System Setup
    • 4.2.1 KVM Extender Setup
    • 4.2.2 Setup of Upgrade Modules
  • 4.3 Example Applications
  • 4.4 Overview Upgrade Modules
• 5 Configuration
  • 5.1 Transmission Parameters
  • 5.2 DDC Settings
  • 5.3 Command Mode
  • 5.4 USB-HID Ghosting
  • 5.5 Configuration File
    • 5.5.1 Parameters for CPU Units
    • 5.5.2 Parameters for CON Units
    • 5.5.3 Parameters for CPU und CON Units
• 6 Operation
  • 6.1 Download of DDC Information
  • 6.2 Parallel Operation of redundant CPU Units
• 7 Specifications
  • 7.1 Interfaces
    • 7.1.1 DVI-D Dual Link
    • 7.1.2 DVI-I Single Link
    • 7.1.3 USB-HID
    • 7.1.4 PS/2
    • 7.1.5 USB 2.0 (transparent)
    • 7.1.6 RJ45 (Interconnect)
    • 7.1.7 Fiber SFP Type LC (Interconnect)
    • 7.1.8 Serial Interface
    • 7.1.9 Serial Interface RS422
    • 7.1.10 Analog Audio Interface
    • 7.1.11 Digital Audio Interface
  • 7.2 Interconnect Cable
    • 7.2.1 Cat X
    • 7.2.2 Fiber
  • 7.3 Supported Peripherals
    • 7.3.1 USB-HID Devices
    • 7.3.2 USB 2.0 Devices
  • 7.4 Connector Pinouts
  • 7.5 Power Supply
  • 7.6 Environmental Conditions
  • 7.7 Size
  • 7.8 Shipping Weight
• 8 Troubleshooting
  • 8.1 General Failures
  • 8.2 Blank Screen
  • 8.3 USB-HID
  • 8.4 Serial Connection
  • 8.5 Analog Audio
  • 8.6 Digital Audio
  • 8.7 Upgrade Module USB-HID
  • 8.8 USB 2.0 embedded
  • 8.9 USB 2.0
• 9 Technical Support
  • 9.1 Support Checklist
  • 9.2 Shipping Checklist
• 10 Certificates
  • 10.1 CE Declaration Of Conformity
  • 10.2 North American Regulatory Compliance
  • 10.3 Product Safety
  • 10.4 WEEE
  • 10.5 RoHS/RoHS 2
• 11 Glossary