Document Outline

• FRONT COVER
• TABLE OF CONTENTS
  • CONTENTS
  • TABLES
  • ILLUSTRATIONS
• SECTION 1 INTRODUCTION
  • 1.1 GENERAL
  • 1.2 INSTALLATION INTEGRITY
  • 1.3 DIAGNOSTIC TOOLS
    • 1.3.1 MODCELL Status LEDs
    • 1.3.2 Application Builder Software
  • 1.3.3 ViZapp Software
  • 1.3.4 MOD 30ML Display
  • 1.3.5 Mini Link / External LEDs
  • 1.4 REPAIR PHILOSOPHY
  • 1.5 RELATED INFORMATION
• SECTION 2 MODCELL STATUS INDICATORS
  • 2 .1 GENERAL
  • 2 .2 INTERPRETING STATUS LED INDICATIONS
  • 2 .3 TROUBLESHOOTING GUIDE
• SECTION 3 VIEWING DIAGNOSTIC DATA
  • 3.1 GENERAL
  • 3.2 APPLICATION BUILDER
    • 3.2.1 Starting the Application Builder
    • 3.2.2 Setting Up Communications
  • 3.3 VIZAPP SOFTWARE
    • 3.3.1 Extended Modbus (XModbus) OPC Server
    • 3.3.2 ICN OPC Server
    • 3.3.3 Setting up Communications
    • 3.3.4 Setting up Communications with XModbus OPC Server
    • 3.3.5 Setting up Communications with ICN OPC Server
    • 3.3.6 Instrument Status Viewer
    • Printing from the Status Window to a text file:
    • 3.4.1 Reading Diagnostics
    • 3.4.2 Reading and Writing Block Attributes
    • 3.4.3 Commands
  • 3.5 MOD 30ML DISPLAY
    • 3.5.1 Reading MOD 30ML Diagnostics
    • 3.5.2 MOD 30ML Commands
• SECTION 4 COMMUNICATIONS
  • 4.1 COMMUNICATING WITH A REPLACEMENT INSTRUMENT
  • 4.2 COMMUNICATION TROUBLESHOOTING
    • 4.2.1 ICN Module Communication
    • 4.2.2 Modbus Module Communication
    • 4.2.3 Built-In ICN Communication
    • 4.2.4 Built-In Modbus Communication
    • Mini Link/ External
    • 4.3 APPLICATION BUILDER/ VIZAPP INSTRUMENT COMMUNICATION ME
• SECTION 5 DIAGNOSING I/O MODULE PROBLEMS
  • 5.1 GENERAL
  • 5.2 READING EXTENDED ERROR CODES
  • 5.3 INTERPRETING EXTENDED ERROR CODE DATA
  • 5.4 SAMPLE MODULE ERRORS
• SECTION 6 DIAGNOSING SHUTDOWN FAULTS
  • 6.1 SHUTDOWN INFORMATION
  • 6.2 RECORDING SHUTDOWN INFORMATION
  • 6.2.1 Application Builder / ViZapp Method
  • 6.2.2 MOD 30ML Display Method
  • 6.2.3 Memory Module Method
• SECTION 7 EVENT CODES AND TRANSITION MESSAGES
  • GENERAL
  • TRANSITION MESSAGE DESCRIPTIONS
  • EVENT CODE DESCRIPTIONS
• SECTION 8 PARTS
  • 8.1 PARTS AVAILABILITY
  • 8.2 BASIC HARDWARE
    • 8.2.1 MODCELL Multiloop Processor
    • 8.2.2 MOD 30ML Multiloop Controller
  • 8.3 I/O MODULES
  • 8.4 COMMUNICATIONS MODULES
  • PARTS
• SECTION 9 HARDWARE, FIRMWARE AND SOFTWARE REVISION HISTORY
  • 9.1 GENERAL
  • 9.2 HARDWARE AND FIRMWARE REVISIONS
  • 9.3 SOFTWARE REVISIONS
• APPENDIX 1
  • A1.1 GENERAL
  • A1.2 CABLE PIN OUTS
  • A1.2.1 Cables for 1720N Communication Link:
  • A1.2.2 Cables for Mini Link External
• APPENDIX 2
  • A2.1 Technical Notes
  • TECHNOTES
    • Instrument Overconfigured
    • Analog Output Readback Error
    • B type thermocouple problem in MOD 30ML and Modcell
    • Faceplate Communication Error
    • Grounding and Wiring Guidelines for MOD 30ML
• BACK COVER
• Comm Cables.pdf
  • Communication Cables Pin-Outs
  • Cables for Minilink, Comm link and MOD 30ML
• Electrical Noise Effects.pdf
  • Cause and Effect of External Electrical Interferences (Noise
    • CAUTION
      • Input signal wires
• overconfig.pdf
  • Instrument Overconfigured Diagnostic alarm in MOD 30ML/Modce