Document Outline

• Foreword
• Definitions and Warnings
• Safety Instructions
• Table of Contents
• 1 Overview
  • 1.1 The MICROMASTER 420
  • 1.2 Features
• 2 Installation
  • 2.1 General
  • 2.2 Ambient operating conditions
  • 2.3 Mechanical installation
    • 2.3.1 Mounting on standard rail, Frame Size A
  • 2.4 Electrical installation
    • 2.4.1 General
    • 2.4.2 Power and motor connections
    • 2.4.3 Control terminals
    • 2.4.4 Avoiding Electro-Magnetic Interference (EMI)
    • 2.4.5 Screening Methods
• 3 Functions
  • 3.1 Parameters
    • 3.1.2 Interconnecting signals (BICO technology)
      • 3.1.2.1 Selecting the command source P0700 / selecting the setpoint source P1000
      • 3.1.2.2 Selection of command/frequency setpoint P0719
      • 3.1.2.3 BICO technology
    • 3.1.3 Reference quantities
    • 3.1.1 Setting / monitoring parameters and parameter attributes
      • Setting parameters
      • Monitoring parameters
  • 3.2 Operator panels for MICROMASTER
    • 3.2.1 Description of the BOP (Basic Operator Panel)
    • 3.2.2 Description of the AOP (Advanced Operator Panel)
    • 3.2.3 Keys and their functions on the operator panel (BOP / AOP)
    • 3.2.4 Changing parameters using the operator panel
  • 3.3 Block diagram
  • 3.4 Factory setting
  • 3.5 Commissioning
    • 3.5.1 50/60 Hz setting
    • 3.5.2 Quick commissioning
    • 3.5.3 Calculating the motor / control data
    • 3.5.4 Motor data identification (stator resistance)
    • 3.5.5 Commissioning the application
      • 3.5.5.1 Serial Interface (USS)
      • 3.5.5.2 Selection of command source
      • 3.5.5.3 Digital input (DIN)
      • 3.5.5.4 Digital output (DOUT)
      • 3.5.5.5 Selection of frequency setpoint
      • 3.5.5.6 Analog input (ADC)
      • 3.5.5.7 Analog output (DAC)
      • 3.5.5.8 Motor potentiometer (MOP)
      • 3.5.5.9 Fixed frequency (FF)
      • 3.5.5.10 JOG
      • 3.5.5.11 Ramp-function generator (HLG)
      • 3.5.5.12 Reference/limit frequencies
      • 3.5.5.13 Motor control
      • 3.5.5.14 Inverter/motor protection
      • 3.5.5.15 Inverter-specific Functions
        • Flying start
        • Automatic restart
        • Holding brake
        • DC braking
        • Compound braking
        • Vdc controller
        • PID controller
    • 3.5.6 Series commissioning
    • 3.5.7 Parameter reset to the factory setting
  • 3.6 Inputs / outputs
    • 3.6.1 Digital inputs (DIN)
    • 3.6.2 Digital output (DOUT)
    • 3.6.3 Analog input (ADC)
    • 3.6.4 Analog output (DAC)
  • 3.7 Communications
    • 3.7.1 Universal serial interface (USS)
      • 3.7.1.1 Protocol specification and bus structure
      • 3.7.1.2 The structure of net data
      • 3.7.1.3 USS bus configuration via COM link (RS485)
  • 3.8 Fixed frequencies (FF)
  • 3.9 Motorized potentiometer (MOP)
  • 3.10 JOG
  • 3.11 PID controller (technological controller)
    • 3.11.1 PID motorized potentiometer (PID-MOP)
    • 3.11.2 PID fixed setpoint (PID-FF)
  • 3.12 Setpoint channel
    • 3.12.1 Summation and modification of the frequency setpoint (AFM)
    • 3.12.2 Ramp-function generator (RFG)
    • 3.12.3 OFF/braking functions
    • 3.12.4 Manual / automatic operation
  • 3.13 Motor holding brake (MHB)
  • 3.14 Electronic brakes
    • 3.14.1 DC braking
    • 3.14.2 Compound braking
  • 3.15 Automatic restart
  • 3.16 Flying restart
  • 3.17 Closed-loop Vdc control
    • 3.17.1 Vdc_max controller
  • 3.18 Monitoring functions / messages
    • 3.18.1 General monitoring functions / messages
  • 3.19 Thermal motor protection and overload responses
    • 3.19.1 Thermal motor model
    • 3.19.2 PTC temperature sensor
  • 3.20 Power module protection
    • 3.20.1 General overload monitoring
    • 3.20.2 Thermal monitoring functions and overload responses
  • 3.21 Open-loop/closed-loop control technique
    • 3.21.1 V/f control
      • 3.21.1.1 Voltage boost
      • 3.21.1.2 V/f open-loop control with flux current control (FCC)
      • 3.21.1.3 Slip compensation
      • 3.21.1.4 V/f resonance damping
      • 3.21.1.5 Current limiting (Imax controller)
• 4 Troubleshooting
  • 4.1 Troubleshooting with the SDP
  • 4.2 Troubleshooting with the BOP
  • 4.3 Fault messages and alarm messages
    • 4.3.1 Fault messages
    • 4.3.2 Alarm messages
    • 4.3.3 Suppressing fault / alarm messages
• 5 MICROMASTER 420 specifications
• 6 Options
  • 6.1 Device-independent options
  • 6.2 Device-dependent options
• 7 Electro-magnetic compatibility (EMC)
  • 7.1 Electro-magnetic compatibility (EMC)
    • 7.1.1 Self-certification
    • 7.1.2 Technical construction file
    • 7.1.3 EC type examination certificate
    • 7.1.4 EMC Directive Compliance with Imminent Harmonics Regulations
    • 7.1.5 Classification of EMC performance
• Appendices
  • A Changing the Operator Panel
  • B Removing Covers
    • B.1 Removing Covers Frame Size A
    • B.2 Removing Covers Frame Size B and C
  • C Removing ‘Y’ Cap
    • C.1 Removing ‘Y’ Cap Frame Size A
    • C.2 Removing ‘Y’ Cap Frame Size B and C
  • D Removing fan
    • D.1 Removing fan, Frame Size A
    • D.2 Removing fan, Frame Sizes B and C
  • E Applicable Standards
  • F Short circuit current rating (SCCR)
  • G List of Abbreviations
  • Index