Intel WiFi Link 5100 User Manual
Intel
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Table of contents
Document Outline
- Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
- 1.0 Introduction
- 2.0 Packaging Technology
- 3.0 Thermal Specifications
- 4.0 Thermal Solution Requirements
- 5.0 Thermal Metrology
- 5.1 MCH Case Measurement
- 5.1.1 Supporting Test Equipment
- 5.1.2 Thermal Calibration and Controls
- 5.1.3 IHS Groove
- 5.1.4 Thermocouple Conditioning and Preparation
- 5.1.5 Thermocouple Attachment to IHS
- Figure 9. Securing Thermocouple Wires with Kapton Tape Prior to Attach
- Figure 10. Thermocouple Bead Placement
- Figure 11. Positioning Bead on Groove
- Figure 12. Using 3D Micromanipulator to Secure Bead Location
- Figure 13. Measuring Resistance between Thermocouple and IHS
- Figure 14. Applying Adhesive on Thermocouple Bead
- 5.1.6 Curing Process
- 5.1.7 Thermocouple Wire Management
- 5.2 Power Simulation Software
- 5.1 MCH Case Measurement
- 6.0 Reference Thermal Solution
- 6.1 AdvancedTCA* Reference Heatsink
- 6.1.1 Thermal Performance
- 6.1.2 Mechanical Design Envelope
- 6.1.3 Board-level Components Keepout Dimensions
- 6.1.4 Torsional Clip Heatsink Thermal Solution Assembly
- 6.1.5 Heatsink Orientation
- 6.1.6 Extruded Heatsink Profiles
- 6.1.7 Mechanical Interface Material
- 6.1.8 Thermal Interface Material
- 6.1.9 Heatsink Clip
- 6.1.10 Clip Retention Anchors
- 6.1.11 Reliability Guidelines
- 6.2 CompactPCI* Reference Heatsink
- 6.1 AdvancedTCA* Reference Heatsink
- 7.0 Reliability Guidelines
- Appendix A Mechanical Drawings
- Table 9. Mechanical Drawing List
- Figure 23. AdvancedTCA* Heatsink Assembly Drawing
- Figure 24. AdvancedTCA* Heatsink Drawing
- Figure 25. AdvancedTCA* Component Keepout Zone
- Figure 26. CompactPCI* Heatsink Assembly Drawing
- Figure 27. CompactPCI* Heatsink Drawing
- Figure 28. CompactPCI* Component Keepout Zone
- Figure 29. Torsional Clip Heatsink Clip Drawing
- Figure 30. TIM2 Drawing
- Appendix B Thermal Solution Component Suppliers