Chapter 11 package outline, Datasheet – SMSC USB20H04 User Manual
Page 35
4-Port USB 2.0 Controller
Datasheet
SMSC USB20H04
Page 35
Revision 1.63 (03-30-07)
DATASHEET
Chapter 11 Package Outline
Figure 11.1 - 64 Pin TQFP Package Outline, 10 x 10 x 1.4 Body, 2 MM Footprint
Table 11.1 - 64 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
~
~
1.60
Overall Package Height
A1
0.05 ~ 0.15
Standoff
A2
1.35 ~ 1.45
Body Thickness
D
11.80 ~ 12.20
X
Span
D1
9.80 ~ 10.20
X
body Size
E
11.80 ~ 12.20
Y
Span
E1
9.80 ~ 10.20
Y
body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length
L1
~ 1.00 ~
Lead
Length
e
0.50 Basic
Lead Pitch
θ
0
o
~ 7
o
Lead Foot Angle
W
0.17 0.22 0.27
Lead
Width
R1
0.08
~
~
Lead Shoulder Radius
R2
0.08
~
0.20
Lead Foot Radius
ccc
~ ~
0.08
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.