NXP Semiconductors CBT3126 - Manual (Page 9)

CBT3126_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 12 October 2009 9 of 13
NXP Semiconductors
CBT3126
Quad FET bus switch
Fig 11. Package outline SOT402-1 (TSSOP14)
UNIT A
1
A
2
A
3
b
p
c D (1) E (2) (1) e H
E
L L
p
Q Z y w v θ
REFERENCES OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 5.1
4.9 4.5
4.3
0.65
6.6
6.2 0.4
0.3 0.72
0.38 8
0 o
o
0.13 0.1 0.2 1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1 MO-153
99-12-27
03-02-18
w M
b p
D
Z
e
0.25
1 7
14 8
θ
A
A 1
A
2
L
p
Q
detail X
L
(A ) 3
H
E
E
c
v M A
X
A
y
0 2.5 5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
A
max.
1.1
pin 1 index