TDK GSM850 - Manual

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001-02 / 20080112 / e741_dpx161990dt.fm
• All specifications are subject to change without notice.
Multilayer Chip Diplexers
For GSM850/GSM900/DCS/PCS
DPX Series DPX161990DT-8003B1
SHAPES AND DIMENSIONS
CIRCUIT DIAGRAM
RECOMMENDED PC BOARD PATTERNS
This width is 50 Ω.
Micro-strip line for 0.4mm thick glass-epoxy substrate.
ELECTRICAL CHARACTERISTICS
• Ta:+25°C
Item Port Frequency range Minimum value Typical value Maximum value
Insertion loss
Lo-band 824 to 960MHz (dB) — — 0.7
Hi-band 1710 to 1990MHz (dB) — — 0.85
Return loss
ANT 824 to 960MHz (dB) 10.0 — —
ANT 1710 to 1990MHz (dB) 10.0 — —
Attenuation
Hi-band 824 to 960MHz (dB) 17.0 — —
Lo-band 1710 to 1990MHz (dB) 15.0 — —
Temperature range
Operating (°C) –40 — +85
Storage (°C) –40 — +85
Conformity to RoHS Directive
0.6 ±0.1
0.8
± 0.15
0.3 ±0.1
0.1 ±0.1 0.25±0.1
1.6 ±0.15
6 5 4
1 2 3
Dimensions in mm
0.55 ±0.1
1 GND
2 ANT
3 GND
4 HIGH
5 GND
6 LOW
Terminal functions
1 2 3
5 6 4
0.4
0.7
0.7
ø0.15 Through-hole
Dimensions in mm
0.7
0.15
Hi-port Lo-port
Ant-port
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and
specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.