Texas Instruments HPL-D SLLU064A - Manual (Page 26)

3-8
3.3 PCB Fabrication Requirements and Stack Up
Stackup
Signal: Layer 1
Notes:
1. PWB TO BE FABRICATED TO MEET OR EXCEED IPC-6012,
CLASS 3 STANDARDS AND WORKMANSHIP SHALL
CONFORM TO IPC-A-600, CLASS 3 CURRENT REVISIONS
2. BOARD MATERIAL AND CONSTRUCTION TO BE UL
APPROVED AND MARKED ON THE FINISHED BOARD.
3. LAMINATE MATERIAL:COPPER-CLAD NELCO N4000-13 (DO NOT USE -13SI)
4. COPPER WEIGHT: 1oz FINISHED
5. FINISHED THICKNESS: 0.062" +/- 0.010"
6. MIN PLATING THICKNESS IN THROUGH HOLES: .001"
7. SMOBC / HASL
8. LPI SOLDERMASK BOTH SIDES USING APPROPRIATE
LAYER ARTWORK: COLOR = GREEN
9. LPI SILKSCREEN AS REQUIRED: COLOR = WHITE
10. VENDOR INFORMATION TO BE INCORPORATED ON BACK SIDE
WHENEVER POSSIBLE
11. MINIMUM COPPER CONDUCTOR WIDTH IS: 0.009"
MINIMUM CONDUCTOR SPACING IS: 0.006"
12. NUMBER OF FINISHED LAYERS: 6
13. ALL 8 MIL HOLES TO BE PLUGGED AND COPLANAR TO
SURFACE
14. SPACING BETWEEN LAYERS 1 AND 2 SHOULD BE 0.0075"
SPACING BETWEEN LAYERS 2 AND 3 SHOULD BE 0.0075"
SPACING BETWEEN LAYERS 4 AND 5 SHOULD BE 0.0075"
SPACING BETWEEN LAYERS 5 AND 6 SHOULD BE 0.0075"
GND: Layer 2
VCC Power: Layer 3
GND: Layer 5
0.0075"
0.0075"
VCCO1 Power: Layer 4
SIGNAL/GND: Layer 6
0.0075"
0.0075"
0.062"