Texas Instruments TPA0253 - Manual (Page 9)

Description
1-3 Introduction
1.2 Description
The TPA0253 audio power amplifier evaluation module is a complete 1-watt
mono audio power amplifier with stereo headphone drive. It consists of the TI
TPA0253 mono 1-W audio power amplifier IC along with a small number of
other parts mounted on a circuit board that measures approximately 2 1/4
inches by 1 1/2 inches (Figure 1–1).
Figure 1–1. The TI TPA0253 Audio Amplifier Evaluation Module
GND
LO/MO+
SHUTDOWN
GND C3
VDD GND
GND
LIN
VDD GND
GND
RIN
TPA0253 EVM Board
U1
+
TEXAS
INSTRUMENTS
2000
R2
S1
R1
STEREO/MONO
C4
C5
R4
C6
C1
C2
J1
R3
R5
SLOP270
SHUTDOWN
R9 R6
C8 C7
R8
R7
+
RO/MO+
Single in-line header pins extend from the underside of the module circuit
board to allow the EVM to be plugged into the TI plug-n-play audio amplifier
evaluation platform, or to be wired directly into existing circuits and equipment
when used stand-alone.
The platform has room for a single TPA0253 evaluation module and is a
convenient vehicle for demonstrating TI’s audio power amplifier and related
evaluation modules. The EVMs simply plug into the platform, which
automatically provides power to the modules, interconnects them correctly,
and connects them to a versatile array of standard audio input and output jacks
and connectors. Easy-to-use configuration controls allow the platform and
EVMs to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers
included with the platform to
hook up.
1.3 TPA0253 EVM Specifications
Supply voltage range, V
DD
2.5 V to 5.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply current, I
DD
0.5A max . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output power per channel, P
O
: 8-
Ω
BTL, V
DD
= 5 V 1 W . . . . . . .
Audio input voltage, V
I,
5 Vp–p max . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Minimum load impedance, R
L
8
Ω
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .