C&H Technology CM900DUC-24NF User Manual

Page 4

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CM900DUC-24NF
Mega Power Dual IGBTMOD™
900 Amperes/1200 Volts

3

01/10 Rev. 0

Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com

Electrical Characteristics,

T

j

= 25°C unless otherwise specified

Characteristics

Symbol

Test Conditions

Min.

Typ.

Max.

Units

Collector-Cutoff Current

I

CES

V

CE

= V

CES

, V

GE

= 0V

1

mA

Gate-Emitter Threshold Voltage

V

GE(th)

I

C

= 90mA, V

CE

= 10V

6

7

8

Volts

Gate Leakage Current

I

GES

V

GE

= V

GES

, V

CE

= 0V

1.0

µA

Collector-Emitter Saturation Voltage (Chip)

V

CE(sat)

I

C

= 900A, V

GE

= 15V, T

j

= 25°C

*6

1.8

2.5

Volts

(Without Lead Resistance)

I

C

= 900A, V

GE

= 15V, T

j

= 125°C

*6

2.0

Volts

Module Lead Resistance

R

(lead)

I

C

= 900A, Terminal-Chip

0.286

Input Capacitance

C

ies

140

nF

Output Capacitance

C

oes

V

CE

= 10V, V

GE

= 0V

16

nF

Reverse Transfer Capacitance

C

res

3

nF

Total Gate Charge

Q

G

V

CC

= 600V, I

C

= 900A, V

GE

= 15V

4800

nC

Inductive

Turn-on Delay Time

t

d(on)

V

CC

= 600V, I

C

= 900A,

600

ns

Load

Rise Time

t

r

V

GE1

= V

GE2

= 15V,

200

ns

Switch

Turn-off Delay Time

t

d(off)

R

G

= 0.35Ω, Inductive Load

800

ns

Times

Fall Time

t

f

Switching Operation

300

ns

Reverse Recovery Time

t

rr

*3

I

E

= 900A

500

ns

Reverse Recovery Charge

Q

rr

*3

50

µC

Emitter-Collector Voltage (Chip)

V

EC

*3

I

E

= 900A, V

GE

= 0V

*6

3.2

Volts

(Without Lead resistance)

External Gate Resistance

R

G

0.35

2.2

Ω

Thermal and Mechanical Characteristics,

T

j

= 25°C unless otherwise specified

Characteristics

Symbol

Test Conditions

Min.

Typ.

Max.

Units

Thermal Resistance, Junction to Case

*1

R

th(j-c)

Q

Per IGBT (1/2 Module)

0.021

°C/W

Thermal Resistance, Junction to Case

*1

R

th(j-c)

D

Per Clamp Diode (1/2 Module)

0.034

°C/W

Contact Thermal Resistance

*1

R

th(c-f)

Thermal Grease Applied (1/2 Module)

0.012

°C/W

*1 Case temperatureT

C

and heatsink temperature (T

f

) measured point is just under the chips.

*3 I

E

, I

EM

, V

EC

, I

FSM

, I

2

t, t

rr

, Q

rr

represent ratings and characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).

*6 Pulse width and repetition rate should be such as to cause negligible teperature rise.

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