Vskt320pbf series, Vishay semiconductors, Triggering – C&H Technology VSKT320PbF Series User Manual

Page 4: Thermal and mechanical specifications, R conduction per junction

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VSKT320PbF Series

www.vishay.com

Vishay Semiconductors

Revision: 05-Jul-12

3

Document Number: 94085

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

Note

• Table shows the increment of thermal resistance R

thJC

when devices operate at different conduction angles than DC

TRIGGERING

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum peak gate power

P

GM

t

p

 5 ms, T

J

= T

J

maximum

10.0

W

Maximum average gate power

P

G(AV)

f = 50 Hz, T

J

= T

J

maximum

2.0

Maximum peak gate current

+ I

GM

t

p

 5 ms, T

J

= T

J

maximum

3.0

A

Maximum peak negative gate voltage

- V

GT

t

p

 5 ms, T

J

= T

J

maximum

5.0

V

Maximum required DC gate voltage to trigger

V

GT

T

J

= - 40 °C

Anode supply = 12 V,
resistive load; Ra = 1

4.0

T

J

= 25 °C

3.0

T

J

= T

J

maximum

2.0

Maximum required DC gate current to trigger

I

GT

T

J

= - 40 °C

Anode supply = 12 V,
resistive load; Ra = 1

350

mA

T

J

= 25 °C

200

T

J

= T

J

maximum

100

Maximum gate voltage that will not trigger

V

GD

T

J

= T

J

maximum, rated V

DRM

applied

0.25

V

Maximum gate current that willnot trigger

I

GD

T

J

= T

J

maximum, rated V

DRM

applied

10.0

mA

Maximum rate of rise of turned-on current

dI/dt

T

J

= T

J

maximum, I

TM

= 400 A,

rated V

DRM

applied

500

A/μs

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Junction operating and storage

temperature range

T

J

, T

Stg

- 40 to 130

°C

Maximum thermal resistance,

junction to case per junction

R

thJC

DC operation

0.125

K/W

Typical thermal resistance,

case to heatsink per module

R

thCS

Mounting surface flat, smooth and greased

0.02

Mounting torque ± 10 %

MAP to heatsink

A mounting compound is recommended
and the torque should be rechecked after

a period of about 3 hours to allow for the
spread of the compound.

4 to 6

Nm

busbar to MAP

Approximate weight

500

g

17.8

oz.

Case style

MAGN-A-PAK

R CONDUCTION PER JUNCTION

DEVICES

SINUSOIDAL CONDUCTION AT T

J

MAXIMUM

RECTANGULAR CONDUCTION AT T

J

MAXIMUM

UNITS

180°

120°

90°

60°

30°

180°

120°

90°

60°

30°

VSKT320-

0.009

0.010

0.013

0.020

0.032

0.007

0.011

0.015

0.020

0.033

K/W

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