Electrical characteristics, t, 25°c unless otherwise specified, Brake part igbt/clampdi – C&H Technology CM75MX-12A User Manual

Page 5: Converter part, Ntc thermistor part

Advertising
background image

CM75MX-12A
NX-Series CIB Module
(3Ø Converter + 3Ø Inverter + Brake)
75 Amperes/600 Volts

Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com

4

Rev. 11/11

Electrical Characteristics,

T

j

= 25°C unless otherwise specified

Characteristics

Symbol

Test Conditions

Min.

Typ.

Max.

Units

Brake Part IGBT/ClampDi

Collector Cutoff Current

I

CES

V

CE

= V

CES

, V

GE

= 0V

1.0

mA

Gate Leakage Current

I

GES

V

GE

= V

GES

, V

CE

= 0V

0.5

µA

Gate-Emitter Threshold Voltage

V

GE(th)

I

C

= 5mA, V

CE

= 0V

5

6

7

Volts

Collector-Emitter Saturation Voltage

V

CE(sat)

T

j

= 25°C, I

C

= 50A, V

GE

= 15V

*5

— 1.7 2.1 Volts

T

j

= 125°C, I

C

= 50A, V

GE

= 15V

*5

— 1.9 — Volts

I

C

= 50A, V

GE

= 15V, Chip

1.6

Volts

Input Capacitance

C

ies

— — 9.3 nF

Output Capacitance

C

oes

V

CE

= 10V, V

GE

= 0V

1.0

nF

Reverse Transfer Capacitance

C

res

— — 0.3 nF

Total Gate Charge

Q

G

V

CC

= 300V, I

C

= 50A, V

GE

= 15V

200

nC

Internal Gate Resistance

r

g

T

C

= 25°C

0

Repetitive Reverse Current

I

RRM

V

R

= V

RRM

— — 1.0 mA

Forward Voltage Drop

V

F

T

j

= 25°C, I

F

= 50A

*5

— 2.0 2.8 Volts

T

j

= 125°C, I

F

= 50A

*5

— 1.95 — Volts

I

F

= 50A, Chip

1.9

Volts

External Gate Resistance

R

G

13 — 125 Ω

Converter Part

Repetitive Peak Reverse Current

I

RRM

V

R

= V

RRM

, T

j

= 150°C

20

mA

Forward Voltage Drop

V

F

I

F

= 75A

*5

— 1.2 1.6 Volts

NTC Thermistor Part

Zero Power Resistance

R

25

T

C

= 25°C

*4

4.85 5.00 5.15 kΩ

Deviation of Resistance

∆R/R R

100

= 493Ω, T

C

= 100°C

*4

-7.3 — +7.8 %

B Constant

B

(25/50)

Approximate by Equation

*6

— 3375 — K

Power Dissipation

P

25

T

C

= 25°C

*4

— — 10 mW

*4 Case temperature (T

C

) and heatsink temperature (T

s

) is measured on the surface

(mounting side) of the baseplate and the heatsink side just under the chips.

Refer to the figure to the right for chip location.

The heatsink thermal resistance should be measured just under the chips.

*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.

*6 B

(25/50)

= In(

R

25

)/(

1

1

)

R

50

T

25

T

50

R

25

; Resistance at Absolute Temperature T

25

[K]; T

25

= 25 [°C] + 273.15 = 298.15 [K]

R

50

; Resistance at Absolute Temperature T

50

[K]; T

50

= 50 [°C] + 273.15 = 323.15 [K]


0

0

0

0

1

2

3 4 5

6

7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22

53

54
55

56
57
58
59

60
61

30
29

28
27
26
25

24
23

52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31

V

P

W

P

W

N

Br

V

N

U

N

U

P

TN

SN

RN

RP SP TP

64.2

73.0

77

.8

81

.4

86.1 91

.4

97

.9

27.6

34.7

41.2

42.0

25.5

42.9

26.5

29.5

26.6

37

.0

47

.4

29.5

39.9

50.3

65.5

Th

95.5

10

1.

2

89.6

98.2

74.6

71

.0

17.8

27.1
33.6 35.2

Dimensions in mm (Tolerance: ±1mm)

IGBT FWDi Converter Diode NTC Thermistor

Chip Location (Top View)

84.6

U

P

V

P

W

P

W

N

V

N

U

N

Br

Advertising