Vsk.26..pbf series, Vishay high power products, Thyristor/diode and thyristor/thyristor (add-a-pak – C&H Technology VSK.26..PbF Series User Manual

Page 4: Generation 5 power modules), 27 a

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Document Number: 94418

For technical questions, contact: [email protected]

www.vishay.com

Revision: 22-Apr-08

3

VSK.26..PbF Series

Thyristor/Diode and Thyristor/Thyristor

(ADD-A-PAK

TM

Generation 5 Power Modules), 27 A

Vishay High Power Products

Note

(1)

Available with dV/dt = 1000 V/ms, to complete code add S90 i.e. VSKT26/16AS90

Note
• Table shows the increment of thermal resistance R

thJC

when devices operate at different conduction angles than DC

TRIGGERING

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum peak gate power

P

GM

10

W

Maximum average gate power

P

G(AV)

2.5

Maximum peak gate current

I

GM

2.5

A

Maximum peak negative gate voltage

- V

GM

10

V

Maximum gate voltage required to trigger

V

GT

T

J

= - 40 °C

Anode supply = 6 V
resistive load

4.0

T

J

= 25 °C

2.5

T

J

= 125 °C

1.7

Maximum gate current required to trigger

I

GT

T

J

= - 40 °C

Anode supply = 6 V
resistive load

270

mA

T

J

= 25 °C

150

T

J

= 125 °C

80

Maximum gate voltage that will not trigger

V

GD

T

J

= 125 °C, rated V

DRM

applied

0.25

V

Maximum gate current that will not trigger

I

GD

T

J

= 125 °C, rated V

DRM

applied

6

mA

BLOCKING

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum peak reverse and off-state
leakage current at V

RRM

, V

DRM

I

RRM

,

I

DRM

T

J

= 125 °C, gate open circuit

15

mA

RMS insulation voltage

V

INS

50 Hz, circuit to base, all terminals shorted

2500 (1 min)

3500 (1 s)

V

Maximum critical rate of rise of off-state voltage

dV/dt

(1)

T

J

= 125 °C, linear to 0.67 V

DRM

500

V/µs

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Junction operating and storage
temperature range

T

J

, T

Stg

- 40 to 125

°C

Maximum internal thermal resistance,
junction to case per module

R

thJC

DC operation

0.31

K/W

Typical thermal resistance,
case to heatsink

R

thCS

Mounting surface flat, smooth and greased

0.1

Mounting torque ± 10 %

to heatsink

A mounting compound is recommended
and the torque should be rechecked after a
period of 3 hours to allow for the spread
of the compound.

5

Nm

busbar

3

Approximate weight

110

g

4

oz.

Case style

JEDEC

TO-240AA

ΔR CONDUCTION PER JUNCTION

DEVICES

SINE HALF WAVE CONDUCTION

RECTANGULAR WAVE CONDUCTION

UNITS

180°

120°

90°

60°

30°

180°

120°

90°

60°

30°

VSK.26

0.23

0.27

0.34

0.48

0.73

0.17

0.28

0.36

0.49

0.73

°C/W

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