Vishay semiconductors – C&H Technology VSKCS408-060 User Manual
Page 3
VSKCS408/060
www.vishay.com
Vishay Semiconductors
Revision: 05-Jan-12
2
Document Number: 94637
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES UNITS
Maximum average
forward current
per module
I
F(AV)
50 % duty cycle at T
C
= 102 °C, rectangular waveform
400
A
per leg
200
Maximum peak one cycle
non-repetitive surge current
I
FSM
5 μs sine or 3 μs rect. pulse
Following any rated
load condition and with
rated V
RRM
applied
25 500
10 ms sine or 6 ms rect. pulse
3300
Non-repetitive avalanche energy
E
AS
T
J
= 25 °C, I
AS
= 5.5 A, L = 1 mH
15
mJ
Repetitive avalanche current
I
AR
Current decaying linearly to zero in 1 μs
Frequency limited by T
J
maximum V
A
= 1.5 x V
R
typical
1
A
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum forward voltage drop
V
FM
200 A
T
J
= 25 °C
0.74
V
400 A
1.09
200 A
T
J
= 125 °C
0.71
400 A
1.02
Maximum reverse leakage current
I
RM
T
J
= 25 °C
V
R
= Rated V
R
2.2
mA
T
J
= 125 °C
650
Maximum junction capacitance
C
T
V
R
= 5 V
DC
(test signal range 100 kHz to 1 MHz), 25 °C
11 000
pF
Typical series inductance
L
S
Measured lead to lead 5 mm from package body
5.0
nH
Maximum voltage rate of change
dV/dt
Rated V
R
10 000
V/μs
Maximum RMS insulation voltage
V
INS
50 Hz
3000 (1 min)
3600 (1 s)
V
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum junction and storage
temperature range
T
J
, T
Stg
- 55 to 150
°C
Maximum thermal resistance,
junction to case per leg
R
thJC
DC
operation
0.26
°C/W
Typical thermal resistance,
case to heatsink per module
R
thCS
0.1
Approximate weight
75
g
2.7
oz.
Mounting torque ± 10 %
to
heatsink
A mounting compound is recommended and the torque
should be rechecked after a period of 3 h to allow for the
spread of the compound.
4
Nm
busbar
3
Case style
JEDEC
TO-240AA compatible