C&H Technology QID4515001 User Manual

Page 4

Advertising
background image

QID4515001
Dual IGBTMOD™ HVIGBT Module
150 Amperes/4500 Volts

Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com

3

11/11 Rev. 6

Electrical Characteristics,

T

j

= 25 °C unless otherwise specified

Characteristics

Symbol

Test Conditions

Min.

Typ.

Max.

Units

Input Capacitance

C

ies

— 18 — nF

Output Capacitance

C

oes

V

GE

= 0V, V

CE

= 10V

1.33

nF

Reverse Transfer Capacitance

C

res

— 0.4 — nF

Resistive

Turn-on Delay Time

t

d(on)

V

CC

= 2250V, I

C

= 150A,

1.5

µs

Load

Rise Time

t

r

V

GE

= ±15V,

0.5

µs

Switching

Turn-off Delay Time

t

d(off)

R

G

= 60Ω, L

S

= 180nH

3.5

µs

Times

Fall Time

t

f

Inductive Load

1.2

µs

Turn-on Switching Energy

E

on

T

j

= 125°C, I

C

= 150A, V

GE

= ±15V,

600

mJ/P

Turn-off Switching Energy

E

off

R

G

= 60Ω, V

CC

= 2250V,

450

mJ/P

L

S

= 180nH , Inductive Load

Diode Reverse Recovery Time**

t

rr

V

CC

= 2250V, I

E

= 150A,

1.8

µs

Diode Reverse Recovery Charge**

Q

rr

V

GE

= ±15V, R

G(on)

= 60Ω,

81*

µC

Diode Reverse Recovery Energy

E

rec

L

S

= 180nH , Inductive Load

55

mJ/P

Stray Inductance (C1-E2)

L

SCE

— 60 — nH

Lead Resistance Terminal-Chip

R

CE

— 0.8 — mΩ

Thermal and Mechanical Characteristics,

T

j

= 25 °C unless otherwise specified

Characteristics

Symbol

Test Conditions

Min.

Typ.

Max.

Units

Thermal Resistance, Junction to Case***

R

th(j-c)

Q

Per IGBT

0.082

0.087

°C/W

Thermal Resistance, Junction to Case***

R

th(j-c)

D

Per FWDi

0.164

0.174

°C/W

Contact Thermal Resistance, Case to Fin

R

th(c-f)

Per

Module,

— 0.018 — °C/W

Thermal Grease Applied, λ

grease

= 1W/mK

Comparative Tracking Index

CTI

600

Clearance Distance in Air (Terminal to Base)

d

a(t-b)

35.0 — — mm

Creepage Distance Along Surface

d

s(t-b)

64 — — mm

(Terminal to Base)

Clearance Distance in Air

d

a(t-t)

19 — — mm

(Terminal to Terminal)

Creepage Distance Along Surface

d

s(t-t)

54 — — mm

(Terminal to Terminal)

*Pulse width and repetition rate should be such that device junction temperature rise is negligible.
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
***T

C

measurement point is just under the chips.

Advertising