C&H Technology D2TO20 - Manual (Page 3)

Document Number: 51055 For technical questions, contact: [email protected] www.vishay.com
Revision: 24-Nov-08 37
D2TO20
Surface Mounted Power Resistor
Thick Film Technology
Vishay Sfernice
POWER RATING
The temperature of the case should be maintained within the
limits specified.
MECHANICAL SPECIFICATIONS
Mechanical Protection Molded
Resistive Element Thick film
Substrate Alumina
Connections Tinned copper
Weight 2.2 g max.
ENVIRONMENTAL SPECIFICATIONS
Temperature Range - 55 °C to 155 °C
Flammability
IEC 60695-11-5
2 applications 30 s
separated by 60 s
DIMENSIONS
Standard package
TO - 263 Style
(D 2 PAK)
100
75
50
25
0
% RA
TED PO
WER
CASE TEMPERATURE IN °C
120
0 20 40 60 80 100 120 140 155
PERFORMANCE
TESTS CONDITIONS REQUIREMENTS
Momentary Overload
IEC 60115-1 §4.13
2 Pr 5 s for R < 2 Ω
1.6 Pr 5 s for R ≥ 2 Ω
Us < 1.5 U
L
± (0.25 % + 0.005
Ω)
Rapid Temperature Change
IEC 60115-1
Test Na
5 cycles - 1 h
- 55 °C to + 155 °C
± (0.5 % + 0.005
Ω)
Load Life
IEC 60115-1
1000 h at + 25 °C
± (1 % + 0.005
Ω)
Humidity (Steady State)
IEC 60115-1
IEC60068-2-3
Test Ca: 56 days R.H. 95 %
± (0.5 % + 0.005
Ω)
Vibration
MIL STD 202
Method 204 - Test. D
10 to 2000 Hz
± (0.2 % + 0.005 Ω)
Terminal Strength
IEC 60115-1
Test Ua1/Tensile: 20 N/10 s
± (0.2 % + 0.005
Ω)
Shock
IEC 60115-1
IEC 60068-2-27
Saw-tooth: 100 gn/6 ms
± (0.5 % + 0.005
Ω)
ASSEMBLY SPECIFICATIONS
For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
TESTS CONDITIONS REQUIREMENTS
Resistance to Soldering Heat
IEC 60115-1
IEC 60068-2-58
Solder Bath method: 270 °C/10 s
± (0.5 % + 0.005
Ω)
Moisture Sensitivity Level (MSL)
IPC/JEDEC J-STD-020C
85 °C/85 % RH/168 h
Level: 1
+ Pass requirements of TCR
Overload and Dielectic Strength after MSL