Vs-gb90da60u, Vishay semiconductors, Thermal and mechanical specifications – C&H Technology VS-GB90DA60U User Manual

Page 4

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VS-GB90DA60U

www.vishay.com

Vishay Semiconductors

Revision: 19-Sep-12

3

Document Number: 94771

For technical questions within your region:

[email protected]

,

[email protected]

,

[email protected]

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

Fig. 1 - Maximum DC IGBT Collector Current vs.

Case Temperature

Fig. 2 - Typical Collector to Emitter Voltage (V)

Fig. 3 - Maximum Allowable Forward Current vs.

Case Temperature, Diode Leg

Fig. 4 - Typical Forward Voltage Drop Characteristics

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

MIN. TYP. MAX.

UNITS

Maximum junction and storage temperature

T

J

, T

Stg

- 40

-

150

°C

Junction to case

IGBT

R

thJC

-

-

0.20

°C/W

Diode

-

-

0.33

Case to sink thermal resistance, flat greased
surface

R

thCS

-

0.1

-

Mounting torque, on termianls and heatsink

T

-

-

1.3

Nm

Weight

-

30

-

g

Case style

SOT-227

I

C

-

Continuous Collector Current (A)

Allowable Case Temperature (°C)

0 20 40 60 80 100 120 140 160

0

20

40

60

80

100

120

140

160

DC

V

CE

-

Collector-to-Emitter Voltage (V)

I

C

-

Collector to Emitter Curr

ent (A)

0.0

1.0

2.0

3.0

4.0

5.0

6.0

0

200

100

50

150

250

300

V

GE

= 15V

T

J

= 150 °C

T

J

= 125 °C

T

J

= 25 °C

I

F

-

Continuous Forward Current (A)

Allowable Case Temperature (°C)

0 20 40 60 80 100 120 140 160 180 200

0

20

40

60

80

100

120

140

160

V

F

-

Forward Voltage Drop (V)

I

F

- Forwar

d

Curr

ent (A)

0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2

0

40

80

120

160

200

T

J

= 25 °C

T

J

= 125 °C

T

J

= 150 °C

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