Vishay semiconductors, Thermal and mechanical specifications – C&H Technology VS-GB300TH120N User Manual

Page 4

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VS-GB300TH120N

www.vishay.com

Vishay Semiconductors

Revision: 17-Sep-12

3

Document Number: 94750

For technical questions within your region:

[email protected]

,

[email protected]

,

[email protected]

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

Fig. 1 - IGBT Typical Output Characteristics

Fig. 2 - IGBT Typical Transfer Characteristics

Fig. 3 - IGBT Switching Loss vs. I

C

Fig. 4 - IGBT Switching Loss vs. R

g

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNITS

Operating junction temperature range

T

J

-

-

150

°C

Storage temperature range

T

STG

- 40

-

125

Junction to case

IGBT

R

thJC

-

-

0.076

K/W

Diode

-

-

0.100

Case to sink

R

thCS

Conductive grease applied

-

0.035

-

Mounting torque

Power terminal screw: M6

2.5 to 5.0

Nm

Mounting screw: M6

3.0 to 5.0

Weight

300

g

I

C

(A)

V

CE

(V)

0

0.5

1.5

1.0

2.0

2.5

3.0

3.5

4

0

400

200

100

300

500

600

125 °C

25 °C

V

GE

= 15 V

I

C

(A)

V

GE

(V)

8

9

6

7

10

11

12

13

400

100

0

200

600

500

300

V

CE

= 20 V

125 °C

25 °C

0

10

20

30

40

50

60

70

80

90

100

0

100

200

300

400

500

600

I

C

(A)

E

on

, E

of

f

(mJ)

E

off

E

on

V

GE

= ± 15 V

T

J

=

125 °C

R

g

= 4.7

Ω

V

CC

= 600 V

E

on

, E

off

(mJ)

R

g

(

Ω)

0

40

50

30

20

10

0

100

50

150

250

200

E

on

V

CC

= 600 V

I

C

= 300 A

V

GE

= ± 15 V

T

J

= 125 °C

E

off

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