C&H Technology CM600DU-12NFH - Manual (Page 5)

CM600DU-12NFH
Dual IGBTMOD™ NFH-Series Module
600 Amperes/600 Volts
4
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
07/11 Rev. 2
Thermal Resistance Characteristics
Thermal Resistance, Junction to Case *2 Rth(j-c)Q Per IGBT — — 0.11 K/W
Thermal Resistance, Junction to Case *2 Rth(j-c)D Per FWDi — — 0.12 K/W
Contact Thermal Resistance, Rth(c-f) Thermal Grease Applied — 0.02 — K/W
Case to Heatsink *2 (Per 1 Module) *7
Thermal Resistance, Junction to Case *3 Rth(j-c')Q Per IGBT — — 0.053 K/W
Thermal Resistance, Junction to Case *3 Rth(j-c')D Per FWDi — — 0.078 K/W
Mechanical Characteristics
Mounting Torque Mt Main Terminals, M6 Screw 31 35 40 in-lb
Ms Mounting to Heatsink, M6 Screw 31 35 40 in-lb
Weight m — 580 — Grams
Flatness of Baseplate ec On Centerline X, Y *8 -100 — +100 µm
Recommended Operating Conditons, Ta = 25°C
(DC) Supply Voltage VCC Applied Across C1-E2 — 300 400 Volts
Gate (-Emitter Drive) Voltage VGE(on) Applied Across G1-Es1 / G2-Es2 13.5 15.0 16.5 Volts
External Gate Resistance RG Per Switch 1.0 — 10 Ω
*2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*3 Case temperature (TC') and heatsink temperature (Ts') is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance {Rth(s-a)} should be measured just under the chips.
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
0
29.4 44.2 77
.2
29.4 44.2 64.8
32.0
44.4
27.3
42.1
G2
E2
E1
G1
C2E1 C1 E2
0 0
0
LABEL SIDE
Each mark points to the center position of each chip.
Tr1 / Tr2 : IGBT Di1 / Di2 : FWDi
Di1
Di1
Tr1
Tr1
Di2 Di2
Tr2 Tr2
X
BOTTOM
– CONCAVE
3 mm
+ CONVEX
– CONCAVE + CONVEX
BOTTOM
BOTTOM
LABEL SIDE
Y