Vishay semiconductors – C&H Technology VS-175BGQ030 User Manual

Page 3

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VS-175BGQ030

www.vishay.com

Vishay Semiconductors

Revision: 04-Jul-11

2

Document Number: 94583

For technical questions within your region:

[email protected]

,

[email protected]

,

[email protected]

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

Note

(1)

Pulse width < 300 μs, duty cycle < 2 %

ELECTRICAL SPECIFICATIONS

PARAMETER SYMBOL

TEST

CONDITIONS

TYP.

MAX.

UNITS

Forward voltage drop

V

FM

(1)

100 A

T

J

= 25 °C

0.47

0.49

V

175 A

0.55

0.59

100 A

T

J

= 150 °C

0.36

0.39

175 A

0.47

0.52

Reverse leakage current

I

RM

(1)

T

J

= 125 °C, V

R

= 15 V

160

220

mA

T

J

= 150 °C, V

R

= 30 V

1400

2000

T

J

= 25 °C

V

R

= Rated V

R

1.3

4.5

T

J

= 125 °C

450

650

Maximum junction capacitance

C

T

V

R

= 5 V

DC

, (test signal range 100 kHz to 1 MHz), 25 °C

8500

pF

Typical series inductance

L

S

Measured from tab to mounting plane

3.5

nH

Maximum voltage rate of change

dV/dt

Rated V

R

10 000

V/μs

THERMAL - MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum junction and storage
temperature range

T

J

, T

Stg

- 55 to 150

°C

Maximum thermal resistance,
junction to case

R

thJC

DC operation

0.25

°C/W

Typical thermal resistance,
case to heatsink

R

thCS

Mounting surface, smooth and greased

0.20

Approximate weight

5

g

0.18

oz.

Mounting torque

minimum

1.2 (10)

N · m

(lbf · in)

maximum

2.4 (20)

Marking device

Case style PowerTab

®

175BGQ045

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