Vishay semiconductors – C&H Technology VS-UFB130FA60 User Manual

Page 3

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VS-UFB130FA60

www.vishay.com

Vishay Semiconductors

Revision: 26-Oct-11

2

Document Number: 93657

For technical questions within your region:

[email protected]

,

[email protected]

,

[email protected]

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

ELECTRICAL SPECIFICATIONS PER DIODE (T

J

= 25 °C unless otherwise specified)

PARAMETER

SYMBOL

TEST CONDITIONS MIN.

TYP.

MAX.

UNITS

Cathode to anode breakdown voltage

V

BR

I

R

= 100 μA

600

-

-

V

Forward voltage

V

FM

I

F

= 60 A

-

1.43

1.80

I

F

= 60 A, T

J

= 125 °C

-

1.23

1.48

I

F

= 120 A

-

1.66

2.10

I

F

= 120 A, T

J

= 125 °C

-

1.50

1.82

Reverse leakage current

I

RM

V

R

= V

R

rated

-

0.1

50

μA

T

J

= 175 °C, V

R

= V

R

rated

-

0.20

1

mA

Junction capacitance

C

T

V

R

= 600 V

-

43

-

pF

DYNAMIC RECOVERY CHARACTERISTICS (T

J

= 25 °C unless otherwise specified)

PARAMETER SYMBOL

TEST

CONDITIONS

MIN.

TYP.

MAX.

UNITS

Reverse recovery time

t

rr

I

F

= 1.0 A, dI

F

/dt = 200 A/μs, V

R

= 30 V

-

37

-

ns

T

J

= 25 °C

I

F

= 50 A

dI

F

/dt = 200 A/μs

V

R

= 200 V

-

79

-

T

J

= 125 °C

-

164

-

Peak recovery current

I

RRM

T

J

= 25 °C

-

6

-

A

T

J

= 125 °C

-

15

-

Reverse recovery charge

Q

rr

T

J

= 25 °C

-

230

-

nC

T

J

= 125 °C

-

1220

-

THERMAL - MECHANICAL SPECIFICATIONS

PARAMETER SYMBOL

TEST

CONDITIONS

MIN. TYP. MAX.

UNITS

Junction to case, single leg conducting

R

thJC

-

-

0.73

°C/W

Junction to case, both leg conducting

-

-

0.365

Case to heatsink

R

thCS

Flat, greased surface

-

0.10

-

Weight

-

30

-

g

Mounting torque

-

1.3

-

Nm

Case style

SOT-227

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