C&H Technology CM100RX-12A - Manual (Page 3)

CM100RX-12A
Six IGBTMOD™ + Brake NX-Series Module
100 Amperes/600 Volts
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272
2 Rev. 3/09
Absolute Maximum Ratings, T
j
= 25°C unless otherwise specified
Characteristics Symbol CM100RX-12A Units
Power Device Junction Temperature T
j
-40 to 150 °C
Storage Temperature T
stg
-40 to 125 °C
Mounting Torque, M5 Mounting Screws — 31 in-lb
Mounting Torque, M5 Main Terminal Screws — 31 in-lb
Module Weight (Typical) — 330 Grams
Baseplate Flatness, On Centerline X, Y (See Below) — ±0 ~ +100 µm
Isolation Voltage, AC 1 minute, 60Hz Sinusoidal V
ISO
2500 Volts
Inverter Sector
Collector-Emitter Voltage (G-E Short) V
CES
600 Volts
Gate-Emitter Voltage (C-E Short) V
GES
±20 Volts
Collector Current (T
C
= 75°C) *1 I
C
100 Amperes
Peak Collector Current (Pulse) *3 I
CM
200 Amperes
Emitter Current (T
C
= 25°C) *1 I
E
*2 100 Amperes
Peak Emitter Current *3 I
EM
*2 200 Amperes
Maximum Collector Dissipation (T
C
= 25°C) *1*4 P
C
400 Watts
Brake Sector
Collector-Emitter Voltage (G-E Short) V
CES
600 Volts
Gate-Emitter Voltage (C-E Short) V
GES
±20 Volts
Collector Current (T
C
= 97°C) *1 I
C
50 Amperes
Peak Collector Current (Pulse) *3 I
CM
100 Amperes
Maximum Collector Dissipation (T
C
= 25°C) *1*4 P
C
280 Watts
Repetitive Peak Reverse Voltage (Clamp Diode Part) V
RRM
*2 600 Volts
Forward Current (T
C
= 25°C) *1 I
F
*2 50 Amperes
Forward Current (Pulse) *3 I
FM
*2 100 Amperes
*1 Case temperature (T
C
) and heatsink temperature (T
f
) are defined on the surface of the baseplate and heatsink at just under the chip.
*2 I
E
, I
EM
, V
EC
, t
rr
and Q
rr
represent ratings and characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
I
F
, I
FM
, I
RRM
, V
FM
and V
RRM
represent ratings and characteristics of the clamp diode.
*3 Pulse width and repetition rate should be such that device junction temperature (T
j
) does not exceed T
j(max)
rating.
*4 Junction temperature (T
j
) should not increase beyond T
j(max)
rating.
34
0
0
0
0
33 32 31 30 29 28 27 26 25 24 23 22
Dimensions in mm (Tolerance: ±1mm)
21 20 19 18 17 16 15 14 13
12 35
36
1 2 3 4
11
10
9
8
7
6
5
IGBT FWDi NTC Thermistor
Chip Location (Top View)
24.8
22.2 31
.7
41
.2
50.7 78.8 88.4 99.5
41.2
29.4
U P V P W P
W N V N U N
Br
22.2 31
.7
41
.2
50.7 79.4 88.4 96.8
21.3
32.2
36.8
U P V P W P
W N
Br
V N U N
30.4
Th
CHIP LOCATION (TOP VIEW) BASEPLATE FLATNESS
MEASUREMENT POINT
HEATSINK SIDE
– : CONCAVE + : CONVEX
– : CONCAVE
X
Y
+ : CONVEX
HEATSINK SIDE