Mitsubishi hvigbt modules, High power switching use insulated type – C&H Technology CM400DY-50H User Manual
Page 3
Mar. 2003
MITSUBISHI HVIGBT MODULES
CM400DY-50H
HIGH POWER SWITCHING USE
INSULATED TYPE
HVIGBT MODULES (High Voltage Insulated Gate Bipolar Transistor Modules)
MAXIMUM RATINGS
(Tj = 25
°
C)
V
GE
= 0V
V
CE
= 0V
DC, T
C
= 80
°
C
Pulse
(Note 1)
Pulse
(Note 1)
T
C
= 25
°
C, IGBT part
—
—
Charged part to base plate, rms, sinusoidal, AC 60Hz 1min.
Main terminals screw M8
Mounting screw M6
Auxiliary terminals screw M4
Typical value
2500
±
20
400
800
400
800
3400
–40 ~ +150
–40 ~ +125
6000
6.67 ~ 13.00
2.84 ~ 6.00
0.88 ~ 2.00
1.5
V
V
A
A
A
A
W
°
C
°
C
V
N·m
N·m
N·m
kg
Collector-emitter voltage
Gate-emitter voltage
Maximum collector dissipation
Junction temperature
Storage temperature
Isolation voltage
Mounting torque
Mass
Collector current
Emitter current
Symbol
Item
Conditions
Unit
Ratings
V
CES
V
GES
I
C
I
CM
I
E
(Note 2)
I
EM (Note 2)
P
C (Note 3)
T
j
T
stg
V
iso
—
—
V
V
V
CE
= V
CES
, V
GE
= 0V
V
GE
= V
GES
, V
CE
= 0V
T
j
= 25
°
C
T
j
= 125
°
C
V
CC
= 1250V, I
C
= 400A, V
GE
= 15V
V
CC
= 1250V, I
C
= 400A
V
GE1
= V
GE2
= 15V
R
G
= 7.5
Ω
Resistive load switching operation
I
E
= 400A, V
GE
= 0V
I
E
= 400A
die / dt = –800A /
µ
s
Junction to case, IGBT part (Per 1/2 module)
Junction to case, FWDi part (Per 1/2 module)
Case to fin, conductive grease applied (Per 1/2 module)
I
C
= 40mA, V
CE
= 10V
I
C
= 400A, V
GE
= 15V (Note 4)
V
CE
= 10V
V
GE
= 0V
5
0.5
4.16
—
—
—
—
—
1.00
2.00
2.00
1.00
3.77
1.20
—
0.036
0.072
—
mA
µ
A
nF
nF
nF
µ
C
µ
s
µ
s
µ
s
µ
s
V
µ
s
µ
C
K/W
K/W
K/W
—
—
3.20
3.60
40
4.4
1.3
1.8
—
—
—
—
2.90
—
85
—
—
0.016
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6.0
4.5
7.5
Collector cutoff current
Gate-emitter
threshold voltage
Gate-leakage current
Collector-emitter
saturation voltage
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Emitter-collector voltage
Reverse recovery time
Reverse recovery charge
Contact thermal resistance
Min
Typ
Max
I
CES
I
GES
C
ies
C
oes
C
res
Q
G
t
d (on)
t
r
t
d (off)
t
f
V
EC (Note 2)
t
rr
(Note 2)
Q
rr (Note 2)
R
th(j-c)Q
R
th(j-c)R
R
th(c-f)
ELECTRICAL CHARACTERISTICS
(Tj = 25
°
C)
Symbol
Parameter
Conditions
V
GE(th)
V
CE(sat)
Limits
Unit
Note 1. Pulse width and repetition rate should be such that the device junction temp. (T
j
) does not exceed T
jmax
rating.
2. I
E
, V
EC
, t
rr
, Q
rr
& die/dt represent characteristics of the anti-parallel, emitter to collector free-wheel diode.
3. Junction temperature (T
j
) should not increase beyond 150
°
C.
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Thermal resistance
HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules