C&H Technology MTP Modules Mounting Instructions - Manual

V I S H A Y H I G H P O W E R P R O D U C T S
Modules Application Note AN-0801
Mounting Instructions for MTP Modules
APPLICATION NOTE
Document Number: 95002 For technical support, contact [email protected] www.vishay.com
Revision: 02-Jul-08 1
By Marcello Turnaturi, Vishay Semiconductors
This application note introduces Vishay´s MTP
rectifier-switch modules and discusses the assembly and
printed circuit board issues involved in their use.
MTP modules are designed to provide reliable performance
in rugged 20 A to 100 A industrial applications. A single
housing is used to integrate power components, providing
higher power density. Various die selections are available in
several configurations. An integrated thermal sensor is also
offered as an option.
Fig. 1 - Example of MTP module
Introduction
Vishay´s MTP modules are distinguished by these key
features:
• Fully isolated
• Compact and easy to mount
• Low profile package suitable for assembly on printed
circuit boards
• Low junction to case thermal resistance
These attributes allow MTP modules to fit into existing
assembly processes using standard reflow profiles.
Important factors in the assembly process are:
• Heatsink design
• PCB design
• Power leads size/area
• Distance from adjacent heating parts
• Solder paste choice
• Reflow profile
• Protection against electrostatic discharge (ESD)
Recommendations for each of these items and requirements
for mounting MTP modules to the PCB are discussed in the
following sections.
ESD protection
IGBT and MOSFET modules are sensitive to ESD. All
MTP modules are ESD-protected during shipment with an
antistatic tube. Anyone handling or working with the
modules during the assembly process must wear a
conductive grounded wristband.
Heatsink Specification
The contact surface of the heatsink must be flat, with a
recommended tolerance of < 0.03 mm (< 1.18 mils) and a
levelling depth of < 0.02 mm (< 0.79 mils), according to
DIN/ISO 1302. In general, a milled or machined surface is
satisfactory if prepared with tools in good working
condition. The heatsink mounting surface must be clean,
with no dirt, corrosion, or surface oxide. It is very important
to keep the mounting surface free from particles exceeding
0.05 mm (2 mils) in thickness