Electrical and mechanical characteristics, t, 25°c unless otherwise specified inverter sector, Thermal and mechanical characteristics, t – C&H Technology CM200RX-12A User Manual

Page 4: 25°c unless otherwise specified

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CM200RX-12A
Six IGBTMOD™ + Brake NX-Series Module
200 Amperes/600 Volts

Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272

3

Rev. 11/08

Electrical and Mechanical Characteristics,

T

j

= 25°C unless otherwise specified

Inverter Sector

Characteristics

Symbol

Test Conditions

Min.

Typ.

Max.

Units

Collector Cutoff Current

I

CES

V

CE

= V

CES

, V

GE

= 0V

1.0

mA

Gate-Emitter Threshold Voltage

V

GE(th)

I

C

= 20mA, V

CE

= 10V

5

6

7

Volts

Gate Leakage Current

I

GES

V

GE

= V

GES

, V

CE

= 0V

0.5

µA

Collector-Emitter Saturation Voltage

V

CE(sat)

I

C

= 200A, V

GE

= 15V, T

j

= 25°C

1.7

2.1

Volts

I

C

= 200A, V

GE

= 15V, T

j

= 125°C

1.9

Volts

I

C

= 200A, V

GE

= 15V, Chip

1.6

Volts

Input Capacitance

C

ies

— — 27.0 nF

Output Capacitance

C

oes

V

CE

= 10V, V

GE

= 0V

2.7

nF

Reverse Transfer Capacitance

C

res

— — 0.8 nF

Total Gate Charge

Q

G

V

CC

= 300V, I

C

= 200A, V

GE

= 15V

530

nC

Inductive

Turn-on Delay Time

t

d(on)

— — 120 ns

Load

Turn-on Rise Time

t

r

V

CC

= 300V, I

C

= 200A,

150

ns

Switch

Turn-off Delay Time

t

d(off)

V

GE

= ±15V,

— — 350 ns

Time

Turn-off Fall Time

t

f

R

G

= 5.6Ω, I

E

= 150A,

600

ns

Reverse Recovery Time*

t

rr

Inductive Load Switching Operation

200

ns

Reverse Recovery Charge*

Qrr

5.0

µC

Emitter-Collector Voltage*

V

EC

I

E

= 200A, V

GE

= 0V, T

j

= 25°C

2.0

2.8

Volts

I

E

= 200A, V

GE

= 0V, T

j

= 125°C

1.95

Volts

I

E

= 200A, V

GE

= 0V, Chip

1.9

Volts

Thermal and Mechanical Characteristics,

T

j

= 25°C unless otherwise specified

Characteristics

Symbol

Test Conditions

Min.

Typ.

Max.

Units

Thermal Resistance, Junction to Case**

R

th(j-c)

Q

Per IGBT

0.17

°C/W

Thermal Resistance, Junction to Case**

R

th(j-c)

D

Per FWDi

0.33

°C/W

Contact Thermal Resistance**

R

th(c-f)

Thermal

Grease

Applied

— 0.015 — °C/W

Internal Gate Resistance

R

Gint

T

C

= 25°C

0

Ω

External Gate Resistance

R

G

3.0 — 30 Ω

*Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
**T

C

, T

f

measured point is just under the chips.

34

0

0

0

0

33 32 31 30 29 28 27 26 25 24 23 22

Dimensions in mm (Tolerance: ±1mm)

21 20 19 18 17 16 15 14 13

12

35

36

1

2

3

4

11

10

9
8
7

6
5

IGBT FWDi NTC Thermistor

Chip Location (Top View)

17.4

22.9

33.9

44.9

55.9

79.4

92.4

106.0

39.7

24.4

U

P

V

P

W

P

W

N

V

N

U

N

Br

100.2

26.8

Th

22.9

33.9

44.9

55.9

79.4

91

.4

10

1.

8

18.3

28.0

35.0

U

P

V

P

W

P

W

N

Br

V

N

U

N

CHIP LOCATION (TOP VIEW)

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