Trek 645 Electrostatic Chuck Supply User Manual

Trek model 645, Electrostatic chuck supply

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Trek Model 645

Electrostatic Chuck Supply

Key Specifications

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Output Phasing:

Voltage A (Reference Phase)

!

!

Output Current Range:

0 to ±2 kV

Voltage B (Phase B = [-1] x Phase A)

0 to ±2 kV

Output Voltage Range:

0 to ±2 kV
0 to ±6.5 mA DC with a peak capability of 10 mA

Typical Applications Include

!

Electrostatic-driven handling of materials

!

Semiconductor wafer processing

!

Non-mechanical transfer of flat panels or other processing materials
sensitive to mechanical clipping

TREK, INC. • 190 Walnut Street • Lockport, NY 14094 • USA • 800-FOR TREK

(fax) • www.trekinc.com • [email protected]

716-438-7555 • 716-201-1804

Features and Benefits

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Supports both Coulombic and Johnsen-Rahbek ESC technologies

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User configurable for custom clamp and declamp sequences and wave shapes

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Electrostatic chuck profiles can be uploaded to the unit and stored internally via a user-friendly software interface

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Documented reduction of backside gas errors, increased throughput, and elimination of sticky/popping wafers

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Lockable front panel control interface

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Ability to control parameters such as over-current, wafer-present and wafer-clamped thresholds, clamp voltage,

offset voltage and internal or external amplitude/offset control

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Wafer detection includes no wafer, wafer present or wafer clamped status

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Includes in-process-adjustable amplitude/offset and output-control versatility

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Output can be controlled by back panel I/O, serial computer command or front panel controls

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NIST-traceable Certificate of Calibration provided with each unit

!

Compliant

Trek’s Model 645 software-driven Electrostatic Chuck Supply
offers an array of features that provide significant benefits while
accommodating a variety of demanding applications.
Documented use shows that customers have seen increases in
efficiency and throughput equal to three times that of other
supplies. Additionally, the Model 645 virtually eliminates sticky
wafer and wafer popping issues, thus ensuring better control over
particle contamination.

Given the versatility and performance of the Model 645, it can be
used in multiple unique tools/processes, thus eliminating the need
to specify a new supply for each unique tool/process in a facility.

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