Rainbow Electronics MAX9258 - Manual (Page 2)

MAX9257/MAX9258
2 _______________________________________________________________________________________
Fully Programmable Serializer/Deserializer
with UART/I
2
C Control Channel
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
_ to GND .........................................................-0.5V to +4.0V
Any Ground to Any Ground...................................-0.5V to +0.5V
SDI+, SDI-, SDO+, SDO- to GND..........................-0.5V to +4.0V
SDO+, SDO- Short Circuit to GND or V
CCLVDS
.........Continuous
DIN[0:15], GPIO[0:9], PCLK_IN, HSYNC_IN, VSYNC_IN,
SCL/TX, SDA/RX, REM to GND ............-0.5V to (V
CCIO
+ 0.5V)
DOUT[0:15], PCLK_OUT, HSYNC_OUT, VSYNC_OUT, RX,
LOCK, TX, PD, ERROR, to GND .......-0.5V to (V
CCOUT + 0.5V)
Continuous Power Dissipation (T A = +70°C)
40-Lead TQFN
Multilayer PCB (derate 35.7mW/°C above +70°C) .....2857mW
48-Lead LQFP
Multilayer PCB (derate 21.7mW/°C above +70°C) .....1739mW
Junction-to-Case Thermal Resistance ( θ
JC ) (Note 1)
40-Lead TQFN .............................................................1.7°C/W
48-Lead LQFP ...............................................................10°C/W
Junction-to-Ambient Thermal Resistance ( θ
JA ) (Note 1)
40-Lead TQFN ..............................................................28°C/W
48-Lead LQFP ...............................................................46°C/W
ESD Protection
Human Body Model (R D = 1.5kΩ, C S = 100pF)
All Pins to GND ..............................................................±3kV
IEC 61000-4-2 (R
D
= 330Ω, C
S
= 150pF)
Contact Discharge
(SDI+, SDI-, SDO+, SDO-) to GND ................................±8kV
Air Discharge
(SDI+, SDI-, SDO+, SDO-) to GND ..............................±20kV
ISO 10605 (R D = 2kΩ, C S = 330pF)
Contact Discharge
(SDI+, SDI-, SDO+, SDO-) to GND ..............................±10kV
Air Discharge
(SDI+, SDI-, SDO+, SDO-) to GND ..............................±30kV
Machine Model (R D = 0Ω, C S = 200pF)
All Pins to GND ............................................................±200V
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
MAX9257 DC ELECTRICAL CHARACTERISTICS
(V CC_ = +3.0V to +3.6V, R L = 50Ω ±1%, T A = -40°C to +105°C, unless otherwise noted. Typical values are at V CC_ = +3.3V,
T A = +25°C.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SINGLE-ENDED INPUTS
V CCIO = +1.71V to +3V
0.65 x
V CCIO
V CCIO +
0.3
V CCIO = +3V to +3.6V 2
V CCIO +
0.3
High-Level Input Voltage V IH
REM input 2
V CC +
0.3
V
V CCIO = +1.71V to +3V 0
0.3 x
V CCIO
V CCIO = +3V to +3.6V 0 0.8
Low-Level Input Voltage V IL
REM input 0 0.8
V
V
IN
= 0 to V
CCIO
V CCIO = +1.71V to +3.6V
-20 +20
Input Current I IN
V IN = 0 to V CC, REM input -20 +20
µA
Input Clamp Voltage V
CL
I
CL
= -18mA -1.5 V
SINGLE-ENDED OUTPUTS
I OH = -100µA
V
CCIO
-
0.1
High-Level Output Voltage V OH
I OH = -2mA
V CCIO -
0.35
V
Note 1: Package thermal resistances were obtained using the method described in JDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .