T7023 – Rainbow Electronics Т7023 User Manual
Page 10
Advertising
10
T7023
4532A–BLURF–09/02
Figure 15.
Application Board Layout
Gerberfiles are available on request.
The application board consists of 4 layers:
1.
top layer: RF-signals, 35 µm Cu
2.
spacing: 490 µm FR4
3.
second layer: GND, 35 µm Cu
4.
spacing: 550 µm FR4
5.
third layer: GND (optional), 35 µm Cu
6.
spacing: 490 µm FR4
7.
bottom layer: DC connection, 35 µm Cu
1µF
1nF
15pF
1µF
1nF
15pF
3.3pF
hQ
56pF
1µF
1nF
10pF
1.5pF hQ
15nH hQ
5.6pF hQ
5.6pF
0R
1.5pF
Advertising