3v supply dc electrical characteristics – Rainbow Electronics MAX19997A User Manual

Page 2

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MAX19997A

Dual, SiGe High-Linearity, 1800MHz to 2900MHz
Downconversion Mixer with LO Buffer

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS

(

Typical Application Circuit optimized for the standard RF band (see Table 1), no input RF or LO signals applied, V

CC

= +4.75V to

+5.25V, T

C

= -40°C to +85°C. Typical values are at V

CC

= +5.0V, T

C

= +25°C, unless otherwise noted. R1, R4 = 750

Ω, R2, R5 =

698

Ω.)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

V

CC

to GND ...........................................................-0.3V to +5.5V

RF_, LO to GND.....................................................-0.3V to +0.3V
IFM_, IFD_, IFM_SET, IFD_SET, LO_ADJ_M,

LO_ADJ_ to GND ...................................-0.3V to (V

CC

+ 0.3V)

RF_, LO Input Power ......................................................+15dBm
RF_, LO Current (RF and LO is DC

shorted to GND through balun)................................... ...50mA

Continuous Power Dissipation (Note 1) ..............................8.7W

θ

JA

(Notes 2, 3)..............................................................+38°C/W

θ

JC

(Notes 1, 3) ...............................................................7.4°C/W

Operating Case Temperature Range

(Note 4) ...................................................T

C

= -40°C to +85°C

Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

V

CC

3.0

3.3

3.6

V

Supply Current

I

CC

Total supply current, V

CC

= +3.3V

279

310

mA

+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS

(

Typical Application Circuit optimized for the standard RF band (see Table 1), no input RF or LO signals applied, V

CC

= +3.0V to

+3.6V, T

C

= -40°C to +85°C. Typical values are at V

CC

= +3.3V, T

C

= +25°C, unless otherwise noted. R1, R4 = 1.1k

Ω, R2, R5 =

845

Ω.)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

V

CC

4.75

5.00

5.25

V

Supply Current

I

CC

Total supply current

388

420

mA

Note 1: Based on junction temperature T

J

= T

C

+ (

θ

JC

x V

CC

x I

CC

). This formula can be used when the temperature of the exposed

pad is known while the device is soldered down to a PCB. See the

Applications Information section for details. The junction

temperature must not exceed +150°C.

Note 2: Junction temperature T

J

= T

A

+ (

θ

JC

x V

CC

x I

CC

). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 4: T

C

is the temperature on the exposed pad of the package. T

A

is the ambient temperature of the device and PCB.

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