Rainbow Electronics MAX19999 - Manual (Page 2)

MAX19999
Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit, no input RF or LO signals applied, V
CC = +4.75V to +5.25V, T C = -40°C to +85°C. Typical values are at
V CC = +5.0V, T C = +25°C, unless otherwise noted. R1 = R4 = 750
Ω, R2 = R5 = 698Ω.)
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit, no input RF or LO signals applied, T C = -40°C to +85°C. Typical values are at
V CC = +3.3V, T C = +25°C, unless otherwise noted. R1, R4 = 1.1k Ω; R2, R5 = 845Ω.) (Note 5)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V CC to GND ...........................................................-0.3V to +5.5V
RF_, LO to GND.....................................................-0.3V to +0.3V
IFM_, IFD_, IFM_SET, IFD_SET, LO_ADJ_M,
LO_ADJ_D to GND.................................-0.3V to (V CC + 0.3V)
RF_, LO Input Power ......................................................+15dBm
RF_, LO Current (RF and LO are DC shorted to GND
through balun).................................................................50mA
Continuous Power Dissipation (Note 1) ..............................8.7W
θ
JA (Notes 2, 3)..............................................................+38°C/W
θ
JC (Note 3).....................................................................7.4°C/W
Operating Case Temperature Range
(Note 4) ...................................................T C = -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V CC 4.75 5 5.25 V
Supply Current I CC Total supply current 388 420 mA
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V CC (Note 6) 3 3.3 3.6 V
Supply Current I
CC
Total supply current 279 mA
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency f RF (Notes 5, 7) 3000 4000 MHz
LO Frequency f LO (Notes 5, 7) 2650 3700 MHz
Using Mini-Circuits TC4-1W-17 4:1
transformer as defined in the Typical
Application Circuit, IF matching
components affect the IF frequency range
(Notes 5, 7)
100 500
IF Frequency f IF
Using alternative Mini-Circuits TC4-1W-7A
4:1 transformer, IF matching components
affect the IF frequency range (Notes 5, 7)
50 250
MHz
LO Drive Level P LO (Note 7) -3 +3 dBm
Note 1: Based on junction temperature T J = T C + ( θ
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature T J = T A + ( θ
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T
C
is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
RECOMMENDED AC OPERATING CONDITIONS