Rainbow Electronics ISD1800 - Manual (Page 22)

ISD1800 SERIES
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12.3. ISD1800 B ONDING P HYSICAL L AYOUT (D IE )
ISD1800
PLAYL PLAYE REC V
SSD
V
CCD
XCLK FT
MIC MIC REF AGC SP - V
SSA
SP + V
CCA
ROSC
RECLED
ISD1800
o
Die Dimensions
X: 2530µm (99.6mils)
Y: 2420µm (95.3mils)
o
Die Thickness
11.5 +0.5 mil (typ)
o
Pad Opening
90 x 90 microns
Notes:
1. The backside of die is internally connected to V
SS
. It MUST NOT be connected to any other potential or
damage may occur.
2. Die thickness is subject to change, please contact Winbond factory for status and availability.