Rainbow Electronics AT28HC256 - Manual (Page 11)

AT28HC256
11
Ordering Information
(1)
t
ACC
(ns)
I
CC
(mA)
Ordering Code Package Operation Range Active Standby
70 80 60 AT28HC256(E,F)-70JC
AT28HC256(E,F)-70PC
32J
28P6
Commercial
(0 °C to 70°C)
0.3 AT28HC256(E,F)-70JI
AT28HC256(E,F)-70PI
32J
28P6
Industrial
(-40 °C to 85°C)
90 80 0.3 AT28HC256(E,F)-90JC
AT28HC256(E,F)-90PC
32J
28P6
Commercial
(0 °C to 70°C)
AT28HC256(E,F)-90JI
AT28HC256(E,F)-90PI
32J
28P6
Industrial
(-40 °C to 85°C)
80 0.3 AT28HC256(E,F)-90DM/883
AT28HC256(E,F)-90FM/883
AT28HC256(E,F)-90LM/883
AT28HC256(E,F)-90UM/883
28D6
28F
32L
28U
Military/883C
Class B, Fully Compliant
(-55 °C to 125°C)
120 80 0.3 AT28HC256(E,F)-12JC
AT28HC256(E,F)-12PC
AT28HC256(E,F)-12SC
AT28HC256(E,F)-12TC
32J
28P6
28S
28T
Commercial
(0 °C to 70°C)
80 0.3 AT28HC256(E,F)-12JI
AT28HC256(E,F)-12PI
AT28HC256(E,F)-12SI
AT28HC256(E,F)-12TI
32J
28P6
28S
28T
Industrial
(-40 °C to 85°C)
80 0.3 AT28HC256(E,F)-12DM/883
AT28HC256(E,F)-12FM/883
AT28HC256(E,F)-12LM/883
AT28HC256(E,F)-12UM/883
28D6
28F
32L
28U
Military/883C
Class B, Fully Compliant
(-55 °C to 125°C)
Package Type
28D6 28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)
28F 28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)
32J 32-lead, Plastic J-leaded Chip Carrier (PLCC)
32L 32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)
28P6 28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
28S 28-lead, 0.300" Wide Plastic Gull Wing Small Outline (SOIC)
28T 28-lead, Plastic Thin Small Outline Package (TSOP)
28U 28-pin, Ceramic Pin Grid Array (PGA)
W Die
Options
Blank Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
E High Endurance Option: Endurance = 100K Write Cycles
F Fast Write Option: Write Time = 3 ms