Rainbow Electronics APExx08 - Manual (Page 6)

APExx08 Series
Rev 1.5 2004/4/20 5
6.0 Bonding Diagram of
APE0508 / APE1008
Pad # Pad Name X Y Pad # Pad Name X Y
1 PWM2/Cout -518 -195 9 PRB0 267 -574
2 Vdd1 -518 -479 10 PRB1 377 -574
3 PWM1 -431 -603 11 Vdd2 487 -574
4 GND1 -283 -603 12 GND2 489 -414
5 PRA0 -173 -574 13 OSC 489 -304
6 PRA1 -63 -574 14 PRB2 489 -194
7 PRA2 47 -574 15 PRB3 489 -84
8 PRA3 157 -574
Chip Size :
APE0508 : 1234 um x 1404 um
APE1008 : 1234 um x 1404 um
ROM
PRB3
2
3 4
5 6 7 8 9 10 11
12
13
14
15
PRB2
OSC
Vdd2
GND2
PRB1 PRB0 PRA3 PRA2 PRA1 PRA0
GND1 PWM1
PWM2/Cout
Vdd1
1
(0, 0)
Pad Size : 80 um x 80 um
* The IC substrate must be connected to GND.
X
Y