Rainbow Electronics MAX3737 - Manual (Page 14)

MAX3737
Exposed-Pad (EP) Package
The exposed-pad on the 32-pin QFN provides a very low
thermal resistance path for heat removal from the IC. The
pad is also electrical ground on the MAX3737 and should
be soldered to the circuit board ground for proper ther-
mal and electrical performance. Refer to Maxim
Application Note HFAN-08.1: Thermal Considerations for
QFN and Other Exposed Pad Packages at www.maxim-
ic.com for additional information.
Multirate Laser Driver with Extinction
Ratio Control
14 ______________________________________________________________________________________
MAX3737
V CC
PACKAGE
0.82nH
0.82nH
OUT-
OUT+
0.11pF
0.11pF
Figure 7. Simplified Output Structure
32 31 30 29 28 27 26
MODTCOMP TH_TEMP MODBCOMP MODSET APCSET APCFILT2 APCFILT1
25
VMD
9 10 11 12 13 14 15
MC_MON
GND V
CC
TX_FAULT
SHUTDOWN
VBS GND
16
GND
17
18
19
20
21
22
23
BIAS
*THE EXPOSED PADDLE MUST BE SOLDERED TO SUPPLY GROUND
TO ACHIEVE SPECIFIED PERFORMANCE.
V
CC
OUT-
OUT-
OUT+
OUT+
V CC
8
7
6
5
4
3
2
BC_MON
PC_MON
V CC
IN-
IN+
V CC
TX_DISABLE
MAX3737ETJ
1 GND 24 MD
TOP VIEW
5mm x 5mm
THIN QFN
Pin Configurations (continued)
Chip Information
TRANSISTOR COUNT: 2727
PROCESS: SiGe/Bipolar