Chip information, Chip topography, Pad coordinates – Rainbow Electronics MAX3745 User Manual
Page 10
MAX3744/MAX3745
2.7Gbps SFP Transimpedance
Amplifiers with RSSI
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
10 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
V
CC
N.C.
V
CC
IN
FILTER
GND
OUT-
OUT+
GND
N.C.
0.03in
(0.76mm)
0.05in
(1.26mm)
1
2
3
4
6
7
8
9
10
5
MAX3744
MAX3745
Pad Coordinates
Chip Information
TRANSISTOR COUNT: 301
PROCESS: SiGe Bipolar
SUBSTRATE: ISOLATED
DIE THICKNESS: 0.014in ±0.001in
Chip Topography
PAD
COORDINATES (
µm)
X
COORDINATES (
µm)
Y
1
1.4
495.6
2
0
336
3
0
224
4
0
112
5
0
0
6
494.2
-1.4
7
865.2
-1.4
8
1005.2
-1.4
9
1005.2
495.6
10
490
495.6