Surface mount fuses, Nano – Littelfuse 465 Series User Manual

Page 2

Advertising
background image

© 2013 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 12/19/13

Surface Mount Fuses

NANO

> 250V UMF Time Lag > 465 Series

Average Time Current Curves

100

100

10

1

0.1

0.01

0.001

1

10

1000

0.1

1

A

1.25

A

1.6

A

2

A

2.5

A

3.15

A

TIME IN SECONDS

CURRENT IN AMPERES

4

A

5

A

6.3

A

Soldering Parameters

Temperature Rerating Curve

Reflow Condition

Pb – Free assembly

pre Heat

- Temperature min (T

s(min)

)

150°C

- Temperature max (T

s(max)

)

200°C

- Time (min to max) (t

s

)

60 – 120 secs

Average ramp up rate (liquidus Temp
(T

l

) to peak

5°C/second max.

T

S(max)

to T

l

- Ramp-up Rate

5°C/second max.

Reflow

- Temperature (T

l

) (liquidus)

217°C

- Temperature (t

l

)

60 – 90 seconds

peak Temperature (T

p

)

260

+0/–5

°C

Time within 5°C of actual peak
Temperature (t

p

)

20 – 40 seconds

Ramp-down Rate

5°C/second max.

Time 25°C to peak Temperature (T

p

)

8 minutes max.

Do not exceed

260°C

Wave Soldering parameters

260°C Peak

Temperature,

3 seconds max.

Note:
1. Derating depicted in this curve is in addition to the standard derating of 15% for

continuous operation.

Time

Te

mperatur

e

T

P

T

L

T

S(max)

T

S(min)

25

t

P

t

L

t

S

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

T

L

to T

P

Advertising